Maybe 3M HT700? http://multimedia.3m.com/mws/mediawebserver?mwsId=66666UF6EVsSyXTtmxfV5xT6EVtQEVs6EVs6EVs6E666666--&fn=78923671503.pdf Never used the stuff but might be worth a try. Regards,Mike Sewell > Date: Tue, 11 Dec 2012 15:35:49 -0500 > From: [log in to unmask] > Subject: Re: [TN] Sugestions for Pre Reflow Component Adhesive > To: [log in to unmask] > > Steve, > > The specified tooling holes are a little loose. I guess I could close up > the holes but the posts do cock slightly. Problem is these will mate into > another board so I want them to be straight. Just a slight cock and the long > pin ends are really out of position. Worse yet they go on an aluminum based > PCB so doing rework takes a lot of heat and is difficult. > > I have used thermosets before but was hoping there was a high temp > "Instant" adhesive. > > Thanks, > Bob K. > > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory > Sent: Tuesday, December 11, 2012 2:43 PM > To: [log in to unmask] > Subject: Re: [TN] Sugestions for Pre Reflow Component Adhesive > > Hi Bob, > > I have a question; what are the dual row connectors that you are using that > rock during reflow? Dual row SMT headers usually have no problems sitting > flush and perpendicular to the surface of the board as long as the footprint > is correct. Is it the locating pin that they are pivoting on? > > I will agree with everyone about using Loctite chipbonder. I've used 3609 to > keep components from moving during reflow. For instance there were some > D-paks where the lay-out of thermal (or ground pad) wasn't correct for the > part, and the part would center itself over the thermal pad during reflow, > which would pull the leads off their pads and result in no heel fillets. A > dot of 3609 was hand dispensed so that it contacted the body of the part and > the PCB, and it would cure enough before the solder went liquidous during > reflow to overcome the surface tension of the solder and keep the part where > it was placed. The board was later spun to fix that footprint and some > issues. > > Steve > > -----Original Message----- > From: Robert Kondner > Sent: Tuesday, December 11, 2012 1:04 PM > To: [log in to unmask] > Subject: [TN] Sugestions for Pre Reflow Component Adhesive > > Hi, > > > > Can anyone make suggestions on an adhesive to hold down components while > they go through the reflow oven? > > > > I plan on using some SMT dual row .025 posts. I get them with locating pins > but they still rock some. I was thinking of placing a drop of cyanoacrylate > (Super Glue Gel) but that stuff gives off terrible odors at high temps. I > don't think it was designed for reflow temps. > > > > Any Suggestions? > > > > Thanks, > > Bob K. > > > > > > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________