November 16, 2012 Many different OEMs are currently performing environmental stress screening (ESS) testing of various types as performed on circuit cards or modules. Some do ESS for temperature cycling only. Some do ESS for vibration only Some do both temperature and vibration. I am trying to gain some information on the number of test failures folks are finding when doing ESS testing. I would appreciate any metrics you can provide as follows: 1. How many total circuit cards or other assemblies are tested on an annual basis? 2. How many of these were subjected to ESS testing? 3. What type of ESS testing was used (e.g., temperature cycle, vibration, temperature plus vibration)? 4. How many circuit cards failed? I am trying to get some bench marks to compare failure rates using ESS testing versus just doing full load testing at ambient temperature for a fixed time period (e.g., 24 hours, 100 hours, etc.). My understanding is that failures found by full load/operating test are normally <1% whereas, for the same product, ESS failure rate is around 1 to 3%. ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________