Good morning. I am trying to estimate the typical change in a solder ball's diameter after reflow. IPC-7095B has great discussion about the typical change in a ball's height after reflow but I did not see anything about diametrical changes. Maybe there is another IPC document that addresses this. Factors such as package weight, # of solder balls, ball alloy, etc. influence collapse so I am sure there is no quick answer buy maybe there is a rule of thumb to estimate the diametrical change. Look forward to any advice. thx Regards, -Joe "This e-mail and any attachments are solely for the use of the addressee and may contain L-3 proprietary information that may also be defined as U.S. Government export controlled technical data. If you are an unintended recipient of this e-mail, use, disclosure or distribution of its content is prohibited. Please notify the sender by return e-mail and immediately delete this message." ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________