What is the Au thickness? How may inserted is the plating rated for? Try XRF testing. Victor, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea Sent: Tuesday, October 23, 2012 7:41 AM To: [log in to unmask] Subject: [TN] Ni barrier thickness - Part II Dear Technos, I guess you had all already guessed where I'm trying to get at: I have Cu diffusion at the surface of the Au on some connecting pins and can't assess the effect on long term reliability. So here comes the second question: are there any studies / rules of thumb that could say how much of the Au surface may be lost without any negative impact on the functionality? I definitely got the message that everything is application related, but just trying my luck... Or, anybody has an idea how could I test the long term reliability in this situation? Thanks, Ioan Tempea, ing. Ingénieur principal de fabrication / Senior Manufacturing Engineer [signature002]<http://www.digico.cc/> 950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f> T+ 1 (450) 967-7100, EXT244 ------------------------------------------------------------------------ [signature001] <http://www.facebook.com/pages/Digico/277076778479> ------------------------------------------------------------------------ Lauréat Dunamis 2012<http://digico.cc/dunamis-2012/> Entreprise manufacturière / Gestion du capital humain ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________