Mr. Pauls was my dad.

Here in Iowa, the Big Bang refers to days when the temperature is over 105 
and the fields of popcorn start to go off.

And I already commented Dewey.  Get with the program.  You can only blame 
the 2 hour time difference so many times.

Doug Pauls



From:   "Whittaker, Dewey (EHCOE)" <[log in to unmask]>
To:     <[log in to unmask]>
Date:   10/09/2012 09:26 AM
Subject:        Re: [TN] ION CHROMATOGRAPHY - EXCESS CHLORIDE CONTENT
Sent by:        TechNet <[log in to unmask]>



Just when you think this is another one of his big bang theories; he's 
spot on. It's probably the printed boards, but I only do class acts so 
I'll let others do the corn. I hear the rustling of the stalks in Iowa, so 
you'll likely being hearing from Mr. Pauls soon.
Dewey 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Naisbitt
Sent: Monday, October 08, 2012 9:54 PM
To: [log in to unmask]
Subject: Re: [TN] ION CHROMATOGRAPHY - EXCESS CHLORIDE CONTENT

Phil and Bev

Not necessarily strange.

Phil, you say you passed ROSE test "of course". What is your pass/fail 
criteria <1.54microgrammes NaCl? If yes, then no wonder it fails IC.

IC is intended to tell you EXACTLY what is on an assembly surface that 
might be causing an electro-chemical problem ...that should have been 
established as a problem from SIR tests.

If it passed SIR tests, then is that "pesky result" really an issue?

As I have maintained:

Use your ROSE test to control your process - not based upon some spurious 
pass/fail limit.

Then run SIR

If there's a problem, run IC or FTIR or more to find out what the root 
cause is.

As regards your control coupon failing - Might I presume that there is a 
solder resist / mask present on the bare board? In most of our test work 
it is the bare board that harbours the most problems - get that right, 
and...bazinga!

Graham Naisbitt


On 9 Oct 2012, at 08:09, Bev Christian wrote:

> Phil,
> Very strange.
> 
> Has the ROSE tester been calibrated?
> Physically what is different between one test sample and the other two?
> Were all three test samples ROSE tested together or separately? 
> Were they shipped together or in separate bags or even in totally 
separate
> packages?
> How far away is your manufacturing facility from the lab?  Next door? 
Next
> city? Next state? 
> What are you getting for chloride readings for your blanks?
> 
> Bev
> 
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Bavaro
> Sent: Monday, October 08, 2012 7:30 PM
> To: [log in to unmask]
> Subject: [TN] ION CHROMATOGRAPHY - EXCESS CHLORIDE CONTENT
> 
> We have some results that have left me puzzled.  We are processing the
> IPC B-52 test PWAs using water soluble paste/flux and we can pass the
> ROSE test (of course) and the SIR test, but fail the IC test for
> excessive choride anion content.
> 
> Here is what baffles me.....our control sample is similar and worse than
> the test samples.
> 
> There seems to be some documentation that the chloride ion might be
> related to mishandling and/or soldermask not being properly cured but I
> don't have any experience with this test result so I am not sure how to
> respond to that (hopefully Terry will chime in on this).  We processed
> all the samples using the proper gloves and bags and doubt that we
> contaminated them.
> 
> We are trying to meet the requirement of 0.9 micro-gm/cm-cm maximum and
> our failing control sample is 3.36, one test sample is 4.67, and the
> other two samples are running at .91 and .90.  What value for chloride
> anion content does a normal WS process yield? Are these numbers way out
> of range for normal test results or is chloride always a pesky result? 
> 
> I am looking for the answer to the question "is this really a problem?"
> 
> The control sample was washed but did not have any paste applied to it
> at all.  The test samples were run through the full assembly reflow
> process then cleaned and Rose tested before shipment to the lab.
> 
> All the rest of the results for the IC test are passing so I don't know
> quite how to proceed from here. 
> 
> My current plan is to run another set of tests with more than one
> control sample, and then to simulate various phases of clean (IOW barely
> cleaned, half cleaned, and then a couple of fully cleaned samples).  As
> I am not really familiar with IC test results, I want to see the what
> the constituents of the "dirt" really look like from an IC test
> perspective as well as repeat the previous test results.
> 
> One item I have noted is that we did not have our chosen board supplier
> build these boards but instead bought these off the shelf from one of
> the dummy component suppliers.  But the thought was that as long as they
> were cleaned using our normal process, they should be acceptable.
> These particular test samples use FR4 and not the high Tg polyimide that
> most of our PWBs are built from.
> 
> Any comments on this would be appreciated.
> 
> 
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