直接做個迴流焊治具就可以了,謝謝

 

Best Regards

 

寄件者: TGAsia [mailto:[log in to unmask]] 代理 曾果
寄件日期: 2012928日星期五 17:29
收件者: [log in to unmask]
主旨: [TGAsia] 回复: [TGAsia] PCB 过炉后拼版变形

 

以下为个人观点:

1.板中间有两个孔,使中间区域支撑点变小,受力效果差引起变形,可考虑拼版方式为阴阳拼版,中间两个孔转到边上。

2v-cut是否太深?建议可提高V-CUT残厚。

3PCB材质,建议用高TG的,这样收受热变形的机率会下降,但价格会高一些。

 

曾德玉

 

------------------ 原始邮件 ------------------

发件人: "Jake Tu"<[log in to unmask]>;

发送时间: 2012928(星期五) 下午5:16

收件人: "TGAsia"<[log in to unmask]>;

主题: Re: [TGAsia] PCB 过炉后拼版变形

 

比较简单的方法是在板前后端在过炉前分别增加一根金属支撑条 防止变形。

 

另外不知道你用的是哪家的回流焊, 一般的炉子都可以增加CBS 系统中央支撑系统, 同步于传输链条, 防止PCBA 过炉变形。

 

Thanks & Best regards!

 

Jake Tu

 


From: TGAsia [mailto:[log in to unmask]] On Behalf Of IQC-Wuhao
Sent: Friday, August 10, 2012 5:34 PM
To: [log in to unmask]

Subject: [TGAsia] PCB 过炉后拼版变形

 

各位:

 

如图所示箭头方向过回流炉后(轨道方式),图示椭圆区域向下凹,整个拼版变形

 

请教:有何方式可以改善? 是什么原因造成此问题?

 

PS: 打第一面小元件时不变形,打第二面(即下图所示)变形

 


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