基板变形在IPC-610里面是有要求的,曲度要小于1.5% MFA Lab Inventec(PuDong) Technology Corporation,Ltd. Puxing Road No.789,MinHang Distrct, Shanghai City MailCode: 201114 Phone: 021-64298888-62250 MP: 13917068648 Email: [log in to unmask] <blocked::mailto:[log in to unmask]> From: TGAsia [mailto:[log in to unmask]] On Behalf Of 傅小杰 (C.QC.AM&SE-製程檢驗) Sent: Monday, September 17, 2012 9:22 AM To: [log in to unmask] Subject: Re: [TGAsia] 基板过波峰焊锡变形判定标准咨询 各位好! 现有一问题向大家请教一下,PCBA过波峰焊锡后基板变形,IPC-A-610C找不到相关判定标准。 对基板变形在多少弧度可允收不会对CHIP 元件产生不良? 基板变形图示如附件 以上请教诸位大仙。 ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ TGAsia是一个为业界同仁提供技术交流的平台。您可以在论坛上提出技术问题,交流行业经验,寻找供应商等。请勿发送任何招聘,广告信息。(注:对于寻求供应商的邮件,请勿回复[log in to unmask],请私下和发件人联系)。如您需要退出该邮件论坛,请直接发送邮件至 [log in to unmask] ,谢谢。 ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________