Good morning all,

We have recently had some boards delaminate and are considering pre-baking as a possible solution.  I need to know some "rules of thumb" for pre-bake time and temperature, suggested atmosphere (dry nitrogen?), allowable time between pre-bake and soldering.

At the moment I only have minimal information on the boards so I don't know their physical size, number of layers or if they are SMT or PTH.

I realize it could be a bad batch and the problem may only be with one group of boards as this is not a common problem with boards form many of our fab houses or CMs.

Thanks in advance,

Phil Nutting
Design for Manufacturing Engineer
Kaiser Systems, Inc.
126 Sohier Road
Beverly, MA 01915
Phone: 978-922-9300 x1310
Fax: 978-922-8374
e-mail: [log in to unmask]<mailto:[log in to unmask]>
www.kaisersystems.com<http://www.kaisersystems.com>
www.linkedin.com/in/philnutting<http://www.linkedin.com/in/philnutting>


________________________________
Note: All the information contained in this e-mail and its attachments is proprietary to Kaiser Systems, Inc. and it may not be reproduced without the prior written permission of sender. If you have received this email in error, please immediately return it to sender and delete the copy you received.


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________