When I was consulting it would be a great source of revenue due to cracking:-) John Sent from my iPad On Aug 9, 2012, at 1:18 PM, Joe Macko <[log in to unmask]> wrote: > All, > > > > A question came up about IPC-A-610 acceptability and the feasibility of > soldering a short piece of 32 awg jumper wire to the "top" of a 0402 > chip capacitor due to space limitations that I would like to hear input > on and the technical risks. Normally, such jumper wires are positioned > parallel to the longest dimension of the solder land and soldered as > recommended by IPC but in this case there is very limited space so it > is proposed that the wire be soldered on "top" of the component. > > > > IPC-A-610E, 8.6.1.1 Jumper Wires, SMT - Chip and Cylindrical End Cap > Components states that that this is a " Defect - Class 1, 2, 3: Wire > soldered on top of chip component termination". > > > > I look forward to hearing back from the hands-on experts. thx > > > > Regards, > > -Joe > > > > > > > "This e-mail and any attachments are solely for the use of the addressee and may contain L-3 proprietary information that may also be defined as U.S. Government export controlled technical data. If you are an unintended recipient of this e-mail, use, disclosure or distribution of its content is prohibited. Please notify the sender by return e-mail and immediately delete this message." > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________