Our pads were 0.2 mm but we did 1000's of them a day using a Type 4 lead paste 100 micron stencil with very little problem once we got the stencil sorted. DEK worked with us to do this all back in 2007!!! It was considered difficult then! :-) Regards Rex Rex Waygood Technical Manager Hansatech EMS provides value manufacturing through engineering and quality Hansatech EMS Limited Benson Road Nuffield Industrial Estate Poole Dorset BH17 0RY United Kingdom [log in to unmask] www.HansatechEMS.com -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Amol Kane (Asteelflash,US) Sent: 16 August 2012 14:34 To: [log in to unmask] Subject: [TN] CSP BGAs Dear Technetters, We are going to be assembling some lead-free 1.6x0.8 mm micro BGAs with 0.5mm pitch and 0.17mm dia board pads. Anybody else have experience with this small a package?....I am concerned that there won't be sufficient flux in the tiny solder deposit to clean the oxides during reflow, leading to graping and/or head in pillow situation. Do I need a dip fluxer for the part to do a flux only attachment, or to augment the amount of flux in the solderpaste-solder bump system? I am told I have no time to do DOEs to determine stencil and reflow parameters, so I am turning to technet for help.....any thoughts? Regards, Amol ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the MessageLabs Email ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________