Does anyone know of a source for a die attach and wire bond (Au wire to Al pads) test kit? Thanks. Syed Sajid Ahmad Center for Nanoscale Science and Engineering (CNSE) NORTH DAKOTA STATE UNIVERSITY Phone 701 231 5880 www.ndsu.edu/cnse<http://www.ndsu.edu/cnse> [cid:[log in to unmask]] ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________