Kevin, Make sure you require a Ni barrier layer between the copper and gold (hard of soft)! Chuck Charles W. Brummer | 3M Manufacturing Engineer 3M Electronic Solutions Division 3M Canoga Park, 8357 Canoga Ave. | Canoga Park, CA 91304 Office: 818 734 4930 [log in to unmask] | www.3M.com This message (including any attachments) may contain material, non-public information or proprietary information and is for the intended recipients only. If you are not the intended recipient, you should notify the sender and delete this message. Any disclosure, copying, or use of this information is strictly prohibited and may subject you to legal liability. From: "Glidden, Kevin" <[log in to unmask]> To: <[log in to unmask]> Date: 08/14/2012 09:15 AM Subject: [TN] PCB finish: ENIG vs. hard gold Sent by: TechNet <[log in to unmask]> Hi everyone, We have a PCB supplier who is offering "Hard Gold" as an alternate to ENIG finish, due to PCB size and processing capabilities. The application is Class 3 (mil/aero). The circuit is thin FR4 and subject to SMT reflow w/ Sn63Pb37 (non RoHS) solder alloy, and moderate flexing in end application. Can anyone offer info on the differences between the two finishes, and/or their suitability? Is there an IPC spec (or specs) that outline "hard gold"? Thanks, Kevin Glidden ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________