At 02:21 PM 8/7/2012, Phil Bavaro wrote:
>I used to do a lot of pin in paste on connectors but it has been long
>enough that I cannot remember if I eliminated the voiding completely or
>not.  My memory says that I achieved the 75% and did not have
>unacceptable voiding.

the older you get, the better you were.

>   I remember the worst part of PIP was the dragout
>problem of inserting the pins through the solder paste and dripping on
>the placement equipment.  Don't have an documents to refer you to
>offhand.  Dean's honeycomb pre-forms sounds like a proven method albeit
>more costly.
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
>Sent: Tuesday, August 07, 2012 2:16 PM
>To: [log in to unmask]
>Subject: Re: [TN] pin in paste
>
>Hi, Joyce.
>Sorry, I tried different methods using paste and different brands of
>paste (including pre-drying) on connector pins but could not escape the
>voids entirely. Pre-drying the paste after insertion/before reflow did
>reduce the voiding, but was not practical from an assembly standpoint. I
>ended up using honeycomb (daisychain) pre-forms, with absolutely no
>voiding but a few minutes of added assembly time. If anyone else has
>ideas, I also would like to hear about them.
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
>Sent: Tuesday, August 07, 2012 4:04 PM
>To: [log in to unmask]
>Subject: [TN] pin in paste
>
>Joyce Koo
>Materials Researcher - Materials Interconnect Lab Research In Motion
>Limited
>Office: (519) 888-7465 79945
>Mobile: (226) 220-4760
>
>Hi, Calling on all of the gurus, Anyone has one or two good reference
>regarding voiding minimization or voiding elimination for pin in paste?
>Hopefully it is not in need of using performs.  Many thanks for all your
>help.
>Best regards,
>             joyce
>
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