TechNetters, In IPC-9708 "Test Methods for Characterization of Printed Board Assembly Pad Cratering" there are three methods listed for testing for pad cratering: pin pull, ball pull and ball shear. With regards to the latter two, how are people doing it? What is the composition of the balls? What is the reflow profile that you use? The document is silent on these questions. Bev RIM ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________