TechNetters,
In IPC-9708 "Test Methods for Characterization of Printed Board Assembly Pad
Cratering" there are three methods listed for testing for pad cratering:
pin pull, ball pull and ball shear.

With regards to the latter two, how are people doing it?  What is the
composition of the balls?  What is the reflow profile that you use? The
document is silent on these questions.
Bev
RIM



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