1 PCB潮湿

2 Flux在预热未完全挥发

3 零件正面本体与PCB紧密合，没有缝隙，即孔阻塞

 

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Bohao Zhou
Sent: Wednesday, June 06, 2012 10:10 AM
To: [log in to unmask]
Subject: [TGAsia] 请教,焊锡引脚上有空洞的原因及判定基准

 


请教各位专家一个问题:
基板在过完波峰焊以后,焊锡引脚上会发生空洞.
附照片:
[log in to unmask]">
请问产生空洞的原因会有哪些呢?另外IPC中有没有关于这方面的判定基准呢?

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