还有一个重要的因素,元件脚大小和孔径的匹配性。如果超过0.2mm,引起焊接锡洞的风险也大大升高。個人非常不贊同你的觀點,因為你的這個結論是錯誤的。 Best Regards 寄件者: TGAsia [mailto:[log in to unmask]] 代理 维乐他爸 寄件日期: 2012年6月7日 10:23 收件者: [log in to unmask] 主旨: [TGAsia] 回复:[TGAsia] 答复: Re: [TGAsia] 答复: [TGAs ia] 请教,焊锡引脚上有空洞的原因及判定基准 还有一个重要的因素,元件脚大小和孔径的匹配性。如果超过0.2mm,引起焊接锡洞的风险也大大升高。 ------------------ 原始邮件 ------------------ 发件人: "Bohao Zhou"<[log in to unmask]<mailto:[log in to unmask]>>; 发送时间: 2012年6月7日(星期四) 上午9:48 收件人: "TGAsia"<[log in to unmask]<mailto:[log in to unmask]>>; 主题: [TGAsia] 答复: Re: [TGAsia] 答复: [TGAs ia] 请教,焊锡引脚上有空洞的原因及判定基准 ***************************************************** 太仓阿尔派电子有限公司 生产技术课:周博浩 地址:江苏太仓经济开发区广州西路1号 TEL:0512-53568111-6421 FAX:0512-53568112 E-Mail:[log in to unmask]<mailto:[log in to unmask]> 发件人: BOHAO ZHOU/AOTA/SPEED 收件人: <[log in to unmask]<mailto:[log in to unmask]>> 抄送: [log in to unmask]<mailto:[log in to unmask]> 日期: 2012-06-07 09:44 主题: 答复: Re: [TGAsia] 答复: [TGAsia] 请教,焊锡引脚上有空洞的原因及判定基准 关于这个问题我们做了很多实验,减少和增大松香的量,增加预热的时间,提高焊接温度 和时间,但是效果都不是很明显, 也尝试过基板预烘干(这个有点效果,但不能彻底解决问题),想请问一下基板预烘干的 温度和时间一般设定为多少度烘干多长时间呢? 基板断面分析\X-RAY 也作过,但是还是没有找到真正的原因. 想请问还可以从哪些方面分析找原因呢? 发件人: <[log in to unmask]<mailto:[log in to unmask]>> 收件人: <[log in to unmask]<mailto:[log in to unmask]>> 日期: 2012-06-07 09:05 主题: Re: [TGAsia] 答复: [TGAsia] 请教,焊锡引脚上有空洞的原因及判定基准 发件人: TGAsia <[log in to unmask]<mailto:[log in to unmask]>> 这种情况还有一种可能,波峰焊在焊接前需要喷涂flux,flux受热时会发生分解产生 气体,要是喷涂的量过大或是flux的活性过强,产生的气体来不及排除,就有可能在 焊点中产生针孔 Thanks and Best Regards Sonic Lu 陆尚 宠辱不惊,闲看庭前花开花落 去留无意,漫随天外云卷云舒 Autoliv Electronics China (ACE) Co.,Ltd Tel: +86-21-67109300-3162 "Yun, Xunisa (惲黎銀 IES)" <[log in to unmask]<mailto:[log in to unmask]>> Sent by: TGAsia <[log in to unmask]<mailto:[log in to unmask]>> To <[log in to unmask]<mailto:[log in to unmask]>> cc 2012-06-06 20:07 Subject [TGAsia] 答复: [TGAsia] 请 Please respond to 教,焊锡引脚上有空洞的原因及 "Yun, Xunisa (惲黎銀 IES)" 判定基准 <[log in to unmask]<mailto:[log in to unmask]>> 我们称之为吹孔,通常是由于PCB 孔壁镀铜异常造成基材膨胀产生的气体外泄所 致,以我们的经验责任判定都是属PCB供应商的,可追偿。 通常需要切片进一步分析才能得到真正原因。 Best Regards Xunisa, Yun EXT: 63184,MVPN:663184 MPT/IPT – Inventec Group 发件人: TGAsia [mailto:[log in to unmask]]<mailto:[mailto:[log in to unmask]]> 代表 Bohao Zhou 发送时间: 2012年6月6日 10:10 收件人: [log in to unmask]<mailto:[log in to unmask]> 主题: [TGAsia] 请教,焊锡引脚上有空洞的原因及判定基准 请教各位专家一个问题: 基板在过完波峰焊以后,焊锡引脚上会发生空洞. 附照片: (Embedded image moved to file: pic17035.gif) 请问产生空洞的原因会有哪些呢?另外IPC中有没有关于这方面的判定基准呢? ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ *************************************************************** Consider the environment before printing this message. To read Autoliv's Information and Confidentiality Notice, follow this link: http://www.autoliv.com/disclaimer.html *************************************************************** ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________