Best Regards
寄件者: TGAsia [mailto:[log in to unmask]]
代理 维乐他爸
寄件日期: 2012年6月7日 10:23
收件者: [log in to unmask]
主旨: [TGAsia] 回复：[TGAsia] 答复: Re: [TGAsia] 答复: [TGAs
ia] 请教,焊锡引脚上有空洞的原因及判定基准
还有一个重要的因素，元件脚大小和孔径的匹配性。如果超过0.2mm，引起焊接锡洞的风险也大大升高。
------------------ 原始邮件
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发件人: "Bohao Zhou"<[log in to unmask]>;
发送时间: 2012年6月7日(星期四)
上午9:48
收件人: "TGAsia"<[log in to unmask]>;
主题: [TGAsia] 答复: Re: [TGAsia]
答复: [TGAs ia] 请教,焊锡引脚上有空洞的原因及判定基准
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太仓阿尔派电子有限公司
生产技术课：周博浩
地址：江苏太仓经济开发区广州西路1号
TEL：0512-53568111-6421
FAX：0512-53568112
E-Mail：[log in to unmask]
发件人: BOHAO ZHOU/AOTA/SPEED
收件人: <[log in to unmask]>
抄送: [log in to unmask]
日期: 2012-06-07 09:44
主题: 答复: Re: [TGAsia] 答复:
[TGAsia] 请教,焊锡引脚上有空洞的原因及判定基准
关于这个问题我们做了很多实验,减少和增大松香的量,增加预热的时间,提高焊接温度
和时间,但是效果都不是很明显,
也尝试过基板预烘干(这个有点效果,但不能彻底解决问题),想请问一下基板预烘干的
温度和时间一般设定为多少度烘干多长时间呢?
基板断面分析\X-RAY 也作过,但是还是没有找到真正的原因.
想请问还可以从哪些方面分析找原因呢?
发件人: <[log in to unmask]>
收件人: <[log in to unmask]>
日期: 2012-06-07 09:05
主题: Re: [TGAsia] 答复: [TGAsia] 请教,焊锡引脚上有空洞的原因及判定基准
发件人： TGAsia <[log in to unmask]>
这种情况还有一种可能，波峰焊在焊接前需要喷涂flux，flux受热时会发生分解产生
气体，要是喷涂的量过大或是flux的活性过强，产生的气体来不及排除，就有可能在
焊点中产生针孔
Thanks and Best Regards
Sonic Lu 陆尚
宠辱不惊，闲看庭前花开花落
去留无意，漫随天外云卷云舒
Autoliv Electronics China (ACE) Co.,Ltd
Tel: +86-21-67109300-3162
"Yun, Xunisa (惲黎銀 IES)"
<[log in to unmask]>
Sent by: TGAsia <[log in to unmask]>
To
<[log in to unmask]>
cc
2012-06-06 20:07
Subject
[TGAsia] 答复: [TGAsia] 请
Please respond to
教,焊锡引脚上有空洞的原因及
"Yun, Xunisa (惲黎銀 IES)"
判定基准
<[log in to unmask]>
我们称之为吹孔，通常是由于PCB 孔壁镀铜异常造成基材膨胀产生的气体外泄所
致，以我们的经验责任判定都是属PCB供应商的，可追偿。
通常需要切片进一步分析才能得到真正原因。
Best Regards
Xunisa, Yun
EXT: 63184，MVPN：663184
MPT/IPT – Inventec Group
发件人: TGAsia [mailto:[log in to unmask]]
代表 Bohao Zhou
发送时间: 2012年6月6日 10:10
收件人: [log in to unmask]
主题: [TGAsia] 请教,焊锡引脚上有空洞的原因及判定基准
请教各位专家一个问题:
基板在过完波峰焊以后,焊锡引脚上会发生空洞.
附照片:
(Embedded image moved to file: pic17035.gif)
请问产生空洞的原因会有哪些呢?另外IPC中有没有关于这方面的判定基准呢?
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