There has been some discussion recently on the phosphorus level for ENiG. My question is: - for electrolytic nickel and gold deposition - would you expect to find phosphorus at the soldered interface? Thanks. Stephen Ayotte Manufacturing Quality Engineer Bldg. 966 - 2, Office 2J1309 Userid: Stephen Ayotte/Burlington/IBM Internet id: [log in to unmask] Phone: 802 769 4775 ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________