Strictly no clean describes a process not just a flux, so the whole process has to be no clean. (Handling processing etc). No clean when applied to fluxes doesn't mean can't clean or don't clean. It just means the material has not been optimized for cleaning but for residues which are considered safe without cleaning (according to some established standard). So the types of risk of cleaning a no clean will be generally similar to comparable to similar efficiency fluxes whether called no clean or not. Within that "risk envelope", due to the different formulation approaches possible in making a no clean product [and similarly for cleaners and processes], the relative risks of one type of hazard from incomplete cleaning compared to another will vary according to your specific flux/cleaner combination and use circumstances. Regards Mike Fenner Bonding Services & Products T: +44 [0] 1865 522 663 E: [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Fabien Guizelin Sent: Thursday, April 26, 2012 2:41 PM To: [log in to unmask] Subject: [TN] Cleaning non-clean paste Hi, Can you summarize the risks linked to cleaning a non-clean paste ? I am concerned by incomplete cleaning of the non-clean leaving active residue on the board. We are using Inudium 5.1 (non-clean, Pb free), cleaned with Vigon A250. We are using non-clean because of experience of that paste (internally and at EMS shop) and we are cleaning to promote underfill bonding. Thanks, Fabien ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________