Hi Victor,

First of all it depends on the type of solder (Pb-free or not). Secondly, you may not necessarily see any thicker intermetallics after re-work, specifically on ENIG.
Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: Victor Hernandez <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Thu, 19 Apr 2012 10:20:09 
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
        <[log in to unmask]>
Subject: [TN] IMC formation Thickness on ENIG

Fellow TechNetters:

   What is the expected IMC formation thickness for a Forced Rework Work 2x process.   Typically I see 2-5 micron on OSP product, given that external copper pad is being leached during the thermal excursion process.   2x formation thickness usually measure less than 10 microns.   However, on ENIG, there is no exposed copper to leach out.   What signs can I look for to confirm multiple thermal excursion.

Victor,


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