Well augmentation is a method for becoming hotter. Dewey -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner Sent: Tuesday, March 27, 2012 1:24 PM To: [log in to unmask] Subject: Re: [TN] Rework Concern and Question Leland, So you are suggesting Si defused into the solder and raised its melting point by 200C ? Did I get that right? Bob K. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall Sent: Tuesday, March 27, 2012 4:14 PM To: [log in to unmask] Subject: Re: [TN] Rework Concern and Question George, It's been a long day, and maybe I'm not making myself too clear. We're not being able to achieve a liquidus state with a 700 degree F soldering iron. We're not trying to melt the lead, just the solder that's holding it to the PCB. We're not accomplishing that with the new component, so I'm thinking something has mixed with the solder joint and has raised the resultant reflow temperature. Leland -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M. Sent: Tuesday, March 27, 2012 4:10 PM To: [log in to unmask] Subject: Re: [TN] Rework Concern and Question Leland, Am I missing something? I don't think it really matter that the lead base material or lead surface finish is. What matters is the solder used to attach the lead to the board. When you desolder a lead you don't melt the lead you melt the solder. Regards, George George M. Wenger Senior Principal Reliability / FMA Engineer Andrew Corporation - Wireless Network Solutions 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 Office (732) 309-8964 Mobile E-mail: [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman Sent: Tuesday, March 27, 2012 4:05 PM To: [log in to unmask] Subject: Re: [TN] Rework Concern and Question Hi Leland - I recommend you find out the lead base metal composition. If you shot an SEM-EDS of the lead toe, you could be getting the Si from the base metal composition and not part of the solder alloy composition. Dave Hillman Rockwell Collins [log in to unmask] Leland Woodall <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 03/27/2012 02:52 PM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Leland Woodall <[log in to unmask]> To <[log in to unmask]> cc Subject Re: [TN] Rework Concern and Question Vladimir, We analyzed raw components straight out of the tape and reel packaging. The site selection was on the bottom side of the leads at the toe. Leland -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of vladimir Igoshev Sent: Tuesday, March 27, 2012 3:12 PM To: [log in to unmask] Subject: Re: [TN] Rework Concern and Question Sorry Ben, it doesn't. Leland, What you are saying sounds strange. What does it mean: "We've analyzed the lead material beneath the SEM and it returns 98% tin and 2% silicone"? Did you analyzed leads or solder? Where the analysis was taken from? Did you analyzed leads with pads ripped off? Regards, Vladimir SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (416) 899-1882 Fax: (905) 882-8812 www.sentec.ca -----Original Message----- From: "Gumpert, Ben" <[log in to unmask]> Sender: TechNet <[log in to unmask]> Date: Tue, 27 Mar 2012 18:58:21 To: <[log in to unmask]> Reply-To: TechNet E-Mail Forum <[log in to unmask]>, "Gumpert, Ben" <[log in to unmask]> Subject: Re: [TN] Rework Concern and Question Leland, I won't claim to be an expert, but this website seems to imply something along those lines. http://resource.npl.co.uk/mtdata/phdiagrams/sisn.htm Ben -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall Sent: Tuesday, March 27, 2012 2:18 PM To: [log in to unmask] Subject: EXTERNAL: [TN] Rework Concern and Question Folks, We've ran across a strange incident and I'd like a little advice from the group. We recently underwent a component vendor change, and part of the first group of boards were misbuilt due to incorrect polarity (the part marking was misinterpreted by the vision operator). Anyway, an attempt to remove the part by our Repair group resulted in lifted pads on 10 of the first 12 boards. We've analyzed the lead material beneath the SEM and it returns 98% tin and 2% silicone. The old style component comes off quite easily (within 3 seconds), and an analysis of its leads shows to be 100% tin. It's a 6 pin diode with very little mass. What's going on here? Does a 2% silicone mix raise the melting point of solder by 200 degrees C? Please help me understand. Thanks, Leland ________________________________ ?Confidentiality Notice: This transmission (including any attachments) may contain confidential information belonging to the sender and is intended only for the use of the party or entity to which it is addressed. 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