Dear All, I am in the process of coming up with a testing plan for evaluating solderpaste inspection (SPI) equipment and have some questions. One of the first things I want to perform is a GR&R study on a NIST certified target of the smallest possible size. I can understand the repeatability part, but is reproducibility a valid measurement criterion as the only operator involvement in this case will be assembly loading/unloading and all other external conditions will remain the same? I also plan to evaluate the effect of board rotation (0 vs 90 degrees) on volume measurements by a simple DOE using ANOVA, investigate process control using control charts and calculate Cpk for the calibration target and actual volume measurements on the most technologically complex assembly we build (0201s, QFNs, fine pitch BGAs etc.,). Don't have anything with a 01005 as of yet. Is there anything else that I have not included (but is a critical data driven factor for evaluation)? Also, If anybody else has performed SPI evaluation in the past and is willing to share their evaluation plan, I can combine it what I have and publish it on technet for future use with due credits. Thanks, Amol ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________