Thanks for your input. Suitability was the wrong choice of words. I was looking for the answer to the question of IPC defect or not. Our designers ignore the dielectric properties of the mask. I was reminded that in the event of a conflict I should use the words in the IPC standard, not the picture. I find figure 10-109 to be in conflict with the words next to 10-116 as the cracks shown in 10-109 connect non common circuits. I find no conflict in the words that have led to the following conclusion for our particular application. If there is a crack adjacent to a trace that does not connect with a non common trace it is not a defect. If there is a crack that communicates with a non common trace it is a defect. There are certainly other considerations relative the boards fabrication, moisture and life issues. Thanks again. Bill Bill Clark Manufacturing Engineering and Quality Manager ERG, Inc. 2601 Wayne Street, Endicott, NY 13760 607-754-9187 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey Sent: Thursday, March 22, 2012 12:39 PM To: [log in to unmask] Subject: Re: [TN] EXTERNAL: [TN] Acceptability of Cracked Solder Mask One a possible cause. There are a couple of questions in my mind: Has the mask performed its role in achieving form fit and function? Is the anomaly and indication that some other condition may exist? In other words, was the board subject to conditions that might have caused some less visible condition that reduces the product life in its service environment. Committee consensus: A1, A2, D3. Your mileage may vary, Guy. -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] Sent: Thursday, March 22, 2012 12:08 PM To: [log in to unmask]; [log in to unmask] Cc: [log in to unmask] Subject: RE: [TN] EXTERNAL: [TN] Acceptability of Cracked Solder Mask Moisture ingression point to the laminate. Victor, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey Sent: Thursday, March 22, 2012 11:04 AM To: [log in to unmask] Subject: Re: [TN] EXTERNAL: [TN] Acceptability of Cracked Solder Mask You looking at pate 10-46 in revE? Cracking of Solder mask: A1, A2, D3. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben Sent: Wednesday, March 21, 2012 3:39 PM To: [log in to unmask] Subject: Re: [TN] EXTERNAL: [TN] Acceptability of Cracked Solder Mask Bill, Looking again at your images, you could say that the cracks don't actually bridge non-common circuits since you have non-solder mask defined pads - the crack ends before it reaches another circuit. Ben -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben Sent: Wednesday, March 21, 2012 3:30 PM To: [log in to unmask] Subject: Re: [TN] EXTERNAL: [TN] Acceptability of Cracked Solder Mask Bill, I see the confusion; 610 mentions a target condition for cracks, but then doesn't follow up with an acceptable or defect condition for cracks. But later in the document, a solder mask scratch that bridges non-common circuits is indicated as a defect for all classes, so I would have to say a crack bridging non-common circuits is also a defect for all classes. Ben -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of William Clark Sent: Wednesday, March 21, 2012 3:03 PM To: [log in to unmask] Subject: EXTERNAL: [TN] Acceptability of Cracked Solder Mask It is not clear to me from IPC 610-E if a crack in a solder mask constitutes a Class 1 or Class 2 defect. Pictures of the typical cracks we are seeing are at the link below. The crack in picture 3 repeats at the same feature on every board in the array. The cracks were not visible on the bare board and the boards passed the tape test. I'm looking for input on the suitability of these boards. Thanks Bill http://s1066.photobucket.com/albums/u408/clarkerg/ Bill Clark Manufacturing Engineering and Quality Manager ERG, <http://www.ergpower.com/> Inc. 2601 Wayne Street, Endicott, NY 13760 607-754-9187 ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. 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