That performance deserves <http://www.itst-shirttime.com/shop/1455-i-got-to-second-base-with-a-tsa-agent-funny-graphic-t-shirt.htm>a t-shirt. 09:44 AM 3/29/2012, Graham Collins wrote: >I figure Doug should pack a bunch of cans in his checked luggage, maybe >toss a couple of sample circuit boards on top of that, and chuck it >through the x-ray machine. What could possibly go wrong? > >Actually, since it has been brought up he will probably try to sneak >that stuff into Hillman's luggage. > >A friend took a couple of boxes of chalk on a trip to a less privileged >country, with the intent to give them to a school. Apparently boxes of >chalk when x-rayed straight on cause a bit of excitement at the x-ray >machine... > >Nothing like a good strip search to start a trip. > >regards, > - Graham > >-----Original Message----- >From: Gregg Owens [mailto:[log in to unmask]] >Sent: Thursday, March 29, 2012 2:52 AM >To: TechNet E-Mail Forum; Collins, Graham (FN) @ PRG - ESI >Subject: RE: NTC RE: [TN] Rework Concern and Question / Mtn Dew > >Graham: > >Do you actually expect Americans to take large quantities of clear >liquids on airplanes? I am sure our security people would tear such suit >case apart after they looked at the x-ray of such a bag. Our security >folks really don't have a well-developed sense of humor. > >Gregg Owens > > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins >Sent: Wednesday, March 28, 2012 6:12 AM >To: [log in to unmask] >Subject: [TN] NTC RE: [TN] Rework Concern and Question / Mtn Dew > >You don't bring your own supply??? Or is it considered a illegal >substance in the UK, similar to trying to bring KinderEggs into the USA? > >regards, > - Graham >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas Pauls >Sent: Wednesday, March 28, 2012 10:09 AM >To: [log in to unmask] >Subject: Re: [TN] Rework Concern and Question > >Ohhhhh, I can tell you from experience there is no Mt Dew or Diet Mt. >Dew in the UK. I go into withdrawal every time I go there. Last time I >came back through the Detroit Airport, the lady in the convenience shop >said she had never seen someone so happy to find a bottle of Diet Mt. >Dew. "Did >you just get back from the UK?" Hilarious. > >Doug Pauls > > > >From: Joyce Koo <[log in to unmask]> >To: <[log in to unmask]> >Date: 03/28/2012 07:57 AM >Subject: Re: [TN] Rework Concern and Question >Sent by: TechNet <[log in to unmask]> > > > >Depend upon which country, cross the boarder you don't have that much >real "stuff" in it. (not sure about UK. It might be the same, since we >both got Queen on our coins). > >Joyce Koo >Materials Researcher - Materials Interconnect Lab Research In Motion >Limited >Office: (519) 888-7465 79945 >Mobile: (226) 220-4760 > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M. >Sent: Wednesday, March 28, 2012 8:53 AM >To: [log in to unmask] >Subject: Re: [TN] Rework Concern and Question > >Mountain Dew also works for some people I know (one in particular) > >Regards, >George >George M. Wenger >Senior Principal Reliability / FMA Engineer Andrew Corporation - >Wireless Network Solutions >40 Technology Drive, Warren, NJ 07059 >(908) 546-4531 Office (732) 309-8964 Mobile >E-mail: [log in to unmask] > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Stewart McCracken >Sent: Wednesday, March 28, 2012 8:42 AM >To: [log in to unmask] >Subject: Re: [TN] Rework Concern and Question > >Oops, just noticed a couple of good typo's in my previous post! >Should be keV and not kV throughout and Sn La1 peak is at 3.44keV not >1.74kV! >Other than that - perfect, the lesson here - more coffee before morning >e-mails.... > >(and its probably still an escape peak rather than a real Si peak!) > >Stewart > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Stewart McCracken >Sent: 28 March 2012 09:43 >To: [log in to unmask] >Subject: Re: [TN] Rework Concern and Question > >Hi Folks, > >Following some of the previous posts, I believe that the "Si" peak which >is being "detected" during EDX, is not a Si peak at all! >There is a very good chance that what the system is showing is an >artefact of the EDX system know as an "escape peak". In this case, a >small "false" >peak occurs at 1.74kV below strongest peak (which in this case will be >Sn >La1 at 1.74kV), giving you what appears as a peak at around 1.7kV which >is around the same as the Si Ka peak 1.74kV). >Bottom line is that the "Si" peak which is being described is most >likely an EDX artefact and not a Si peak at all! > >Kind regards, > >Stewart > > >Stewart McCracken >MCS Ltd. >Centre House >Midlothian Innovation Centre >Roslin >Midlothian >EH25 9RE >U.K. > >t. +44 (0)131 440 9090 >m. +44(0)7711 541735 >e. [log in to unmask] >w. www.themcsgroup.co.uk > > > > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner >Sent: 28 March 2012 00:30 >To: [log in to unmask] >Subject: Re: [TN] Rework Concern and Question > >I sincerely doubt any Si in the solder, Probably the Si you are seeing >is from silica filler in the device body or something like that. >So what is happening to stop solder re-melting? >Possibly if the device leads are copper then with extended heating the >Cu can dissolve into the near pure Sn solder and drive the liquidus up - >and the longer you heat the greater the Cu dissolution and the higher >the MP. >You are probably dissolving out the PCB pad/through hole barrel as well. >The Cu/Sn phase diagram looks like a tick or check mark. The short Sn >down stroke side is from 232 to low point of 227 and the Cu up stroke >side is near vertical to MP of Cu somewhere over 1000C, so you get a >very rapid temp increase for small compositional change. > >Suggest try come in with a hot iron (more than 700) to melt out the >existing composition quickly or flush with more solder to add tin to the >mix and depress MP. Or both. > > >Regards > >Mike Fenner >Bonding Services & Products >T: +44 [0] 1865 522 663 E: [log in to unmask] > > > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D. >Sent: Tuesday, March 27, 2012 10:01 PM >To: [log in to unmask] >Subject: Re: [TN] Rework Concern and Question > >I think, but am not sure, that you are attempting to remove a new >component whose leads are FINISHED (not soldered) with SAC305 solder, >and that is why you measure Sn98 on the parts straight out of the tape >(I am going to disregard the SEM analysis of 2% silicon for a moment). > >Secondly, the new parts were probably soldered to the PWB with SAC305 >solder as well, and that is why when you attempt to unsolder them or >bring them into liquidus, you are having more difficulty than you did >with the old parts. > >Not only were the old parts finished with Sn63 solder, but they were >also soldered in place with Sn63 solder. >The new parts are meant to be RoHS compliant, and apparently they are, >with a Sn level of 98%, and no Pb in sight on the SEM diagram. If that >were the only change, you should notice no difference in the ability to >remove the part if they were, in fact, soldered to the PWB with Sn63; >the plating change alone would not make any noticeable difference. > >Soldering them to the PWB with lead-free SAC305 alloy would make a huge >difference in your ability to unsolder and remove the part, no matter >what finish was used to plate the part. > >Silicon will not break down and become part of an alloy under 1000 deg. >C. >The 2% SEM pickup is probably silicon chips or dust from the component >body. > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M. >Sent: Tuesday, March 27, 2012 3:25 PM >To: [log in to unmask] >Subject: Re: [TN] Rework Concern and Question > >Dave Hillman, > >With your metallurgical background you might be a better person than I >to make a comment. I'm not sure I've even had or seen an occasion where >something dissolved in the bulk solder and increased the >melting/solidification temperature. Yes I've seen the leading edge of >solder as it flows and wets a surface dissolve metallization and freeze >because the local meting temperature changed but I've never seen that >happen to the bulk of a solder joint > >Regards, >George >George M. Wenger >Senior Principal Reliability / FMA Engineer Andrew Corporation - >Wireless Network Solutions >40 Technology Drive, Warren, NJ 07059 >(908) 546-4531 Office (732) 309-8964 Mobile >E-mail: [log in to unmask] > > >-----Original Message----- >From: Leland Woodall [mailto:[log in to unmask]] >Sent: Tuesday, March 27, 2012 4:14 PM >To: TechNet E-Mail Forum; Wenger, George M. >Subject: RE: [TN] Rework Concern and Question > >George, > >It's been a long day, and maybe I'm not making myself too clear. > >We're not being able to achieve a liquidus state with a 700 degree F >soldering iron. We're not trying to melt the lead, just the solder >that's holding it to the PCB. We're not accomplishing that with the new >component, so I'm thinking something has mixed with the solder joint and > >has raised the resultant reflow temperature. > >Leland > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M. >Sent: Tuesday, March 27, 2012 4:10 PM >To: [log in to unmask] >Subject: Re: [TN] Rework Concern and Question > >Leland, > >Am I missing something? I don't think it really matter that the lead >base material or lead surface finish is. What matters is the solder >used to attach the lead to the board. When you desolder a lead you >don't melt the lead you melt the solder. > >Regards, >George >George M. Wenger >Senior Principal Reliability / FMA Engineer Andrew Corporation - >Wireless Network Solutions >40 Technology Drive, Warren, NJ 07059 >(908) 546-4531 Office (732) 309-8964 Mobile >E-mail: [log in to unmask] > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman >Sent: Tuesday, March 27, 2012 4:05 PM >To: [log in to unmask] >Subject: Re: [TN] Rework Concern and Question > >Hi Leland - I recommend you find out the lead base metal composition. If > >you shot an SEM-EDS of the lead toe, you could be getting the Si from >the base metal composition and not part of the solder alloy composition. > >Dave Hillman >Rockwell Collins >[log in to unmask] > > > >Leland Woodall <[log in to unmask]> Sent by: TechNet ><[log in to unmask]> >03/27/2012 02:52 PM >Please respond to >TechNet E-Mail Forum <[log in to unmask]>; Please respond to Leland Woodall > ><[log in to unmask]> > > >To ><[log in to unmask]> >cc > >Subject >Re: [TN] Rework Concern and Question > > > > > > >Vladimir, > >We analyzed raw components straight out of the tape and reel packaging. >The site selection was on the bottom side of the leads at the toe. > >Leland > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of vladimir Igoshev >Sent: Tuesday, March 27, 2012 3:12 PM >To: [log in to unmask] >Subject: Re: [TN] Rework Concern and Question > >Sorry Ben, it doesn't. >Leland, > >What you are saying sounds strange. What does it mean: "We've analyzed >the lead material beneath the SEM and it returns 98% tin and 2% >silicone"? >Did >you analyzed leads or solder? Where the analysis was taken from? Did you > >analyzed leads with pads ripped off? > >Regards, > >Vladimir > >SENTEC Testing Laboratory Inc. >11 Canadian Road, Unit 7. >Scarborough, ON M1R 5G1 >Tel: (416) 899-1882 >Fax: (905) 882-8812 >www.sentec.ca > >-----Original Message----- >From: "Gumpert, Ben" <[log in to unmask]> >Sender: TechNet <[log in to unmask]> >Date: Tue, 27 Mar 2012 18:58:21 >To: <[log in to unmask]> >Reply-To: TechNet E-Mail Forum <[log in to unmask]>, > "Gumpert, Ben" > <[log in to unmask]> >Subject: Re: [TN] Rework Concern and Question > >Leland, > >I won't claim to be an expert, but this website seems to imply something > >along those lines. >http://resource.npl.co.uk/mtdata/phdiagrams/sisn.htm > >Ben > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall >Sent: Tuesday, March 27, 2012 2:18 PM >To: [log in to unmask] >Subject: EXTERNAL: [TN] Rework Concern and Question > >Folks, > >We've ran across a strange incident and I'd like a little advice from >the group. > >We recently underwent a component vendor change, and part of the first >group of boards were misbuilt due to incorrect polarity (the part >marking was misinterpreted by the vision operator). > >Anyway, an attempt to remove the part by our Repair group resulted in >lifted pads on 10 of the first 12 boards. We've analyzed the lead >material beneath the SEM and it returns 98% tin and 2% silicone. The >old style component comes off quite easily (within 3 seconds), and an >analysis of its leads shows to be 100% tin. It's a 6 pin diode with >very little mass. > >What's going on here? Does a 2% silicone mix raise the melting point of > >solder by 200 degrees C? > >Please help me understand. > >Thanks, > >Leland > >________________________________ > >?Confidentiality Notice: >This transmission (including any attachments) may contain confidential >information belonging to the sender and is intended only for the use of >the party or entity to which it is addressed. If you are not the >intended recipient, you are hereby notified that any disclosure, >copying, distribution, retention or the taking of action in reliance on >the contents of this transmission is strictly prohibited. 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