Must be one of those fine points of REACH buried in the admini-babble of the legislation. Doug Pauls From: "Peter Swanson" <[log in to unmask]> To: "TechNet E-Mail Forum" <[log in to unmask]>, <[log in to unmask]> Cc: <[log in to unmask]> Date: 03/28/2012 11:26 AM Subject: Re: [TN] Rework Concern and Question Rumour has it that US recipe Mt Dew is banned in UK and locally available product is therefore adulterated. Sent from my iPhone Peter Swanson Office: +44 1865 842842 Mobile: + 44 7785 908556 On 28 Mar 2012, at 18:20, "Douglas Pauls" <[log in to unmask]> wrote: > Ooooooooooooooo, and there is one in Oxfordshire. I owe you one Ian. > Thanks > > Doug Pauls > > > > From: "Fox, Ian" <[log in to unmask]> > To: TechNet E-Mail Forum <[log in to unmask]>, > "[log in to unmask]" <[log in to unmask]> > Date: 03/28/2012 10:40 AM > Subject: RE: [TN] Rework Concern and Question > > > > Doug, you are looking in the wrong places. Next time try Asda (owned by > walmart) they do mt. dew. I hate to see a man suffer............. > > Regards > Ian > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas Pauls > Sent: 28 March 2012 14:09 > To: [log in to unmask] > Subject: Re: [TN] Rework Concern and Question > > Ohhhhh, I can tell you from experience there is no Mt Dew or Diet Mt. Dew > in the UK. I go into withdrawal every time I go there. Last time I came > back through the Detroit Airport, the lady in the convenience shop said > she had never seen someone so happy to find a bottle of Diet Mt. Dew. "Did > > you just get back from the UK?" Hilarious. > > Doug Pauls > > > > From: Joyce Koo <[log in to unmask]> > To: <[log in to unmask]> > Date: 03/28/2012 07:57 AM > Subject: Re: [TN] Rework Concern and Question > Sent by: TechNet <[log in to unmask]> > > > > Depend upon which country, cross the boarder you don't have that much real > "stuff" in it. (not sure about UK. It might be the same, since we both > got Queen on our coins). > > Joyce Koo > Materials Researcher - Materials Interconnect Lab Research In Motion > Limited > Office: (519) 888-7465 79945 > Mobile: (226) 220-4760 > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M. > Sent: Wednesday, March 28, 2012 8:53 AM > To: [log in to unmask] > Subject: Re: [TN] Rework Concern and Question > > Mountain Dew also works for some people I know (one in particular) > > Regards, > George > George M. Wenger > Senior Principal Reliability / FMA Engineer Andrew Corporation - Wireless > Network Solutions 40 Technology Drive, Warren, NJ 07059 > (908) 546-4531 Office (732) 309-8964 Mobile > E-mail: [log in to unmask] > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Stewart McCracken > Sent: Wednesday, March 28, 2012 8:42 AM > To: [log in to unmask] > Subject: Re: [TN] Rework Concern and Question > > Oops, just noticed a couple of good typo's in my previous post! > Should be keV and not kV throughout and Sn La1 peak is at 3.44keV not > 1.74kV! > Other than that - perfect, the lesson here - more coffee before morning > e-mails.... > > (and its probably still an escape peak rather than a real Si peak!) > > Stewart > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Stewart McCracken > Sent: 28 March 2012 09:43 > To: [log in to unmask] > Subject: Re: [TN] Rework Concern and Question > > Hi Folks, > > Following some of the previous posts, I believe that the "Si" peak which > is being "detected" during EDX, is not a Si peak at all! > There is a very good chance that what the system is showing is an artefact > of the EDX system know as an "escape peak". In this case, a small "false" > peak occurs at 1.74kV below strongest peak (which in this case will be Sn > La1 at 1.74kV), giving you what appears as a peak at around 1.7kV which is > around the same as the Si Ka peak 1.74kV). > Bottom line is that the "Si" peak which is being described is most likely > an EDX artefact and not a Si peak at all! > > Kind regards, > > Stewart > > > Stewart McCracken > MCS Ltd. > Centre House > Midlothian Innovation Centre > Roslin > Midlothian > EH25 9RE > U.K. > > t. +44 (0)131 440 9090 > m. +44(0)7711 541735 > e. [log in to unmask] > w. www.themcsgroup.co.uk > > > > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner > Sent: 28 March 2012 00:30 > To: [log in to unmask] > Subject: Re: [TN] Rework Concern and Question > > I sincerely doubt any Si in the solder, Probably the Si you are seeing is > from silica filler in the device body or something like that. > So what is happening to stop solder re-melting? > Possibly if the device leads are copper then with extended heating the Cu > can dissolve into the near pure Sn solder and drive the liquidus up - and > the longer you heat the greater the Cu dissolution and the higher the MP. > You are probably dissolving out the PCB pad/through hole barrel as well. > The Cu/Sn phase diagram looks like a tick or check mark. The short Sn down > stroke side is from 232 to low point of 227 and the Cu up stroke side is > near vertical to MP of Cu somewhere over 1000C, so you get a very rapid > temp increase for small compositional change. > > Suggest try come in with a hot iron (more than 700) to melt out the > existing composition quickly or flush with more solder to add tin to the > mix and depress MP. Or both. > > > Regards > > Mike Fenner > Bonding Services & Products > T: +44 [0] 1865 522 663 E: [log in to unmask] > > > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D. > Sent: Tuesday, March 27, 2012 10:01 PM > To: [log in to unmask] > Subject: Re: [TN] Rework Concern and Question > > I think, but am not sure, that you are attempting to remove a new > component whose leads are FINISHED (not soldered) with SAC305 solder, and > that is why you measure Sn98 on the parts straight out of the tape (I am > going to disregard the SEM analysis of 2% silicon for a moment). > > Secondly, the new parts were probably soldered to the PWB with SAC305 > solder as well, and that is why when you attempt to unsolder them or bring > them into liquidus, you are having more difficulty than you did with the > old parts. > > Not only were the old parts finished with Sn63 solder, but they were also > soldered in place with Sn63 solder. > The new parts are meant to be RoHS compliant, and apparently they are, > with a Sn level of 98%, and no Pb in sight on the SEM diagram. If that > were the only change, you should notice no difference in the ability to > remove the part if they were, in fact, soldered to the PWB with Sn63; the > plating change alone would not make any noticeable difference. > > Soldering them to the PWB with lead-free SAC305 alloy would make a huge > difference in your ability to unsolder and remove the part, no matter what > finish was used to plate the part. > > Silicon will not break down and become part of an alloy under 1000 deg. C. > The 2% SEM pickup is probably silicon chips or dust from the component > body. > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M. > Sent: Tuesday, March 27, 2012 3:25 PM > To: [log in to unmask] > Subject: Re: [TN] Rework Concern and Question > > Dave Hillman, > > With your metallurgical background you might be a better person than I to > make a comment. I'm not sure I've even had or seen an occasion where > something dissolved in the bulk solder and increased the > melting/solidification temperature. Yes I've seen the leading edge of > solder as it flows and wets a surface dissolve metallization and freeze > because the local meting temperature changed but I've never seen that > happen to the bulk of a solder joint > > Regards, > George > George M. Wenger > Senior Principal Reliability / FMA Engineer Andrew Corporation - Wireless > Network Solutions 40 Technology Drive, Warren, NJ 07059 > (908) 546-4531 Office (732) 309-8964 Mobile > E-mail: [log in to unmask] > > > -----Original Message----- > From: Leland Woodall [mailto:[log in to unmask]] > Sent: Tuesday, March 27, 2012 4:14 PM > To: TechNet E-Mail Forum; Wenger, George M. > Subject: RE: [TN] Rework Concern and Question > > George, > > It's been a long day, and maybe I'm not making myself too clear. > > We're not being able to achieve a liquidus state with a 700 degree F > soldering iron. We're not trying to melt the lead, just the solder that's > > holding it to the PCB. We're not accomplishing that with the new > component, so I'm thinking something has mixed with the solder joint and > has raised the resultant reflow temperature. > > Leland > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M. > Sent: Tuesday, March 27, 2012 4:10 PM > To: [log in to unmask] > Subject: Re: [TN] Rework Concern and Question > > Leland, > > Am I missing something? I don't think it really matter that the lead base > > material or lead surface finish is. What matters is the solder used to > attach the lead to the board. When you desolder a lead you don't melt the > > lead you melt the solder. > > Regards, > George > George M. Wenger > Senior Principal Reliability / FMA Engineer Andrew Corporation - Wireless > Network Solutions > 40 Technology Drive, Warren, NJ 07059 > (908) 546-4531 Office (732) 309-8964 Mobile > E-mail: [log in to unmask] > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman > Sent: Tuesday, March 27, 2012 4:05 PM > To: [log in to unmask] > Subject: Re: [TN] Rework Concern and Question > > Hi Leland - I recommend you find out the lead base metal composition. If > you shot an SEM-EDS of the lead toe, you could be getting the Si from the > base metal composition and not part of the solder alloy composition. > > Dave Hillman > Rockwell Collins > [log in to unmask] > > > > Leland Woodall <[log in to unmask]> Sent by: TechNet > <[log in to unmask]> > 03/27/2012 02:52 PM > Please respond to > TechNet E-Mail Forum <[log in to unmask]>; Please respond to Leland Woodall > <[log in to unmask]> > > > To > <[log in to unmask]> > cc > > Subject > Re: [TN] Rework Concern and Question > > > > > > > Vladimir, > > We analyzed raw components straight out of the tape and reel packaging. > The site selection was on the bottom side of the leads at the toe. > > Leland > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of vladimir Igoshev > Sent: Tuesday, March 27, 2012 3:12 PM > To: [log in to unmask] > Subject: Re: [TN] Rework Concern and Question > > Sorry Ben, it doesn't. > Leland, > > What you are saying sounds strange. What does it mean: "We've analyzed the > > lead material beneath the SEM and it returns 98% tin and 2% silicone"? Did > > you analyzed leads or solder? Where the analysis was taken from? Did you > analyzed leads with pads ripped off? > > Regards, > > Vladimir > > SENTEC Testing Laboratory Inc. > 11 Canadian Road, Unit 7. > Scarborough, ON M1R 5G1 > Tel: (416) 899-1882 > Fax: (905) 882-8812 > www.sentec.ca > > -----Original Message----- > From: "Gumpert, Ben" <[log in to unmask]> > Sender: TechNet <[log in to unmask]> > Date: Tue, 27 Mar 2012 18:58:21 > To: <[log in to unmask]> > Reply-To: TechNet E-Mail Forum <[log in to unmask]>, > "Gumpert, Ben" > <[log in to unmask]> > Subject: Re: [TN] Rework Concern and Question > > Leland, > > I won't claim to be an expert, but this website seems to imply something > along those lines. > http://resource.npl.co.uk/mtdata/phdiagrams/sisn.htm > > Ben > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall > Sent: Tuesday, March 27, 2012 2:18 PM > To: [log in to unmask] > Subject: EXTERNAL: [TN] Rework Concern and Question > > Folks, > > We've ran across a strange incident and I'd like a little advice from the > group. > > We recently underwent a component vendor change, and part of the first > group of boards were misbuilt due to incorrect polarity (the part marking > was misinterpreted by the vision operator). > > Anyway, an attempt to remove the part by our Repair group resulted in > lifted pads on 10 of the first 12 boards. We've analyzed the lead > material beneath the SEM and it returns 98% tin and 2% silicone. The old > style component comes off quite easily (within 3 seconds), and an analysis > > of its leads shows to be 100% tin. It's a 6 pin diode with very little > mass. > > What's going on here? Does a 2% silicone mix raise the melting point of > solder by 200 degrees C? > > Please help me understand. > > Thanks, > > Leland > > ________________________________ > > ?Confidentiality Notice: > This transmission (including any attachments) may contain confidential > information belonging to the sender and is intended only for the use of > the party or entity to which it is addressed. If you are not the intended > recipient, you are hereby notified that any disclosure, copying, > distribution, retention or the taking of action in reliance on the > contents of this transmission is strictly prohibited. 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