Is it an electroless void or a tin resist etch out void? Pictures are worth a thousand words. At 12:41 PM 3/23/2012, [log in to unmask] wrote: >I'm looking for input on the following plating defect. > >I observe a plating void that occurs on a Cu plated feature with >ENIG finish. The void goes down to the base material. The defect >is typically .002 diameter. The feature size is .010 across. The >parts run on a manual plating line and hang on a small plating rack. > >The plating engineer believes the root cause of the void is a bubble >on the part during plating. The action plan includes implementing >stronger vibration on the part in the plating bath. > >I have two questions. >1. How much vibration is typically needed to avoid developing a >bubble on a part during plating? >2. For this plating void defect, is it possible that Ni corrosion >or other reliability concerns would eventually develop if defective >parts escaped? > >Thank you, > >Mark Julstrom > >______________________________________________________________________ >This email has been scanned by the Symantec Email Security.cloud service. >For more information please contact helpdesk at x2960 or [log in to unmask] >______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________