Is it an electroless void or a tin resist etch out void?

Pictures are worth a thousand words.

At 12:41 PM 3/23/2012, [log in to unmask] wrote:
>I'm looking for input on the following plating defect.
>
>I observe a plating void that occurs on a Cu plated feature with 
>ENIG finish.    The void goes down to the base material.  The defect 
>is typically .002 diameter.  The feature size is .010 across.  The 
>parts run on a manual plating line and hang on a small plating rack.
>
>The plating engineer believes the root cause of the void is a bubble 
>on the part during plating.  The action plan includes implementing 
>stronger vibration on the part in the plating bath.
>
>I have two questions.
>1.  How much vibration is typically needed to avoid developing a 
>bubble on a part during plating?
>2.  For this plating void defect, is it possible that Ni corrosion 
>or other reliability concerns would eventually develop if defective 
>parts escaped?
>
>Thank you,
>
>Mark Julstrom
>
>______________________________________________________________________
>This email has been scanned by the Symantec Email Security.cloud service.
>For more information please contact helpdesk at x2960 or [log in to unmask]
>______________________________________________________________________


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________