All,

在維修拔BGA后﹐發現有掉PCB PAD現象(如圖中左上點)﹐但不知是什么原因造成﹐希
望各位支支招。謝謝﹗

現象﹕
1. 掉PAD位置有區域集中性﹐集中在BGA的同一邊的兩個角
2. 表面來看﹐掉PAD點都是無線路連接點
3. 有對BGA rework profile調整﹐但無效果




William

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