All, 在維修拔BGA后﹐發現有掉PCB PAD現象(如圖中左上點)﹐但不知是什么原因造成﹐希 望各位支支招。謝謝﹗ 現象﹕ 1. 掉PAD位置有區域集中性﹐集中在BGA的同一邊的兩個角 2. 表面來看﹐掉PAD點都是無線路連接點 3. 有對BGA rework profile調整﹐但無效果 William ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________