Additional problem:
how many leads ?
from co-planarity table:
Min stencil thickness doubles just to reach bottom of lead from .004 for
5-10 leads to .008 mil for 25-36 leads.

This is before you have enough paste to create the large fillet.

On Wed, Feb 22, 2012 at 1:42 PM, Gumpert, Ben <[log in to unmask]> wrote:

> Technetters,
>
> Is anyone using the TSM series connector from Samtec?
> See:
> http://www.samtec.com/documents/webfiles/cpdf/TSM-1XX-XX-XX-DV-S-XXX-XX-MKT1.pdf
>
> Is this considered a gull wing for J-STD-001 solder joint requirements?
>
> At .63 mm square, this is a relatively thick lead that requires a lot of
> solder to get a heel fillet to the top of the lead (class 3 solder joint).
> I realize that there are several ways to add solder (overprint, dispense,
> preforms, etc.), but I don't want to go down those paths if I'm not working
> to the right requirement.
>
> Ben
>
>
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