Additional problem: how many leads ? from co-planarity table: Min stencil thickness doubles just to reach bottom of lead from .004 for 5-10 leads to .008 mil for 25-36 leads. This is before you have enough paste to create the large fillet. On Wed, Feb 22, 2012 at 1:42 PM, Gumpert, Ben <[log in to unmask]> wrote: > Technetters, > > Is anyone using the TSM series connector from Samtec? > See: > http://www.samtec.com/documents/webfiles/cpdf/TSM-1XX-XX-XX-DV-S-XXX-XX-MKT1.pdf > > Is this considered a gull wing for J-STD-001 solder joint requirements? > > At .63 mm square, this is a relatively thick lead that requires a lot of > solder to get a heel fillet to the top of the lead (class 3 solder joint). > I realize that there are several ways to add solder (overprint, dispense, > preforms, etc.), but I don't want to go down those paths if I'm not working > to the right requirement. > > Ben > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________