I am . Karen Carpenter TechSearch International Inc. Office: 607-748-7910 Mobile: 607-206-1148 --- On Tue, 2/14/12, Matt Holzmann <[log in to unmask]> wrote: From: Matt Holzmann <[log in to unmask]> Subject: [EM] news release - tech Search To: [log in to unmask] Date: Tuesday, February 14, 2012, 9:19 PM Came across this today. Jan, are you reading our e mails? Embedded Components Generate New Discussion February 14, 2012 Embedded components-actives and passives-embedded in IC package substrates are generating renewed interest. TechSearch International's recent Advanced Packaging Update provides an insight into the new developments at a variety of companies and the driving forces for these embedded devices. The primary advantage of embedding active devices in a package substrate is reduced package height, but thermal advantages have also been reported. Several companies, including FlipChip International/Fujikura, Fujitsu Microelectronics, Shinko Electric, and STATS ChipPAC report that their embedded substrates can be used to assemble package-on-package (PoP) with a total package height of 1.0mm or less (including solder balls), and that there is significant interest from mobile manufacturers. Embedding the die also improves robustness in mechanical shock (drop test), and increases security by making the device more tamper-proof. Embedded passives, primarily capacitors, have different drivers, and are used to improve decoupling and enable higher operating frequencies on the processor. There are two initial markets for this technology: the high-end networking and communication devices, and the low-power mobile application processors. It appears that mobile processors will be the first to use embedded capacitors in production. TechSearch International's annual survey on substrate design rules providing special coverage of substrate design rules from suppliers of organic flip chip substrates, PBGAs, and laminate CSPs (FBGAs) worldwide is highlighted. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish. An economic outlook for the industry is provided with an update on the flood recovery in Thailand. The report is 79 pages and a complimentary set of PowerPoint slides is provided. TechSearch International, Inc., founded in 1987, is market research firm specializing in technology trends microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 15,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887, fax: 512-372-8889, or http//www.techsearchinc.com. Matt Holzmann President www.christopherweb.com 714.979.7500 ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________