Regardless of the "temptations" involved (and to educate the uninformed) What factors contribute to lower copper peel strength? I haven't heard much discussion of that, and I don't think my trusty ol' Printed Circuits Handbook addresses it. (well actually, it discusses TESTING of peel strength in 8.8-8.11, and peel strength values, but not cause). I would probably suspect bare board issues too, unless you can enlighten me... Jack (aka "the new guy") . On Thu, 12 Jan 2012 08:41:02 -0800, Dwight Mattix <[log in to unmask]> wrote: >"A good PWB will normally fail within the laminate material. " > >That's a pretty broad statement. I wouldn't take that bet personally. > >It's tempting as an OEM for failure investigation to begin with the >premise that responsibility lies with any or all inputs except the >design, assembly process. Yep'r, don't keep no mirrors around here to look in. > > >At 07:59 AM 1/12/2012, Woolley, Mark D. (Mark) wrote: >> >> >>I am in the middle of an issue concerning a high temperature Laminate >>and low pull force copper pads. The copper can be pulled from the PWB >>with low pull forces and are failing in the field. >> >>I have examined multiple damaged PWBs and have found that in ALL cases >>the damage is the failure of the copper to epoxy bond. A good PWB will >>normally fail within the laminate material. >> >>The units are built using Pb-free processes with Pb-free components. I >>am trying to determine what can be done to show that the laminate is not >>good or in the PWB manufacturer did not laminage the layers correctly. >>I do not have easy access to bare PWBs that have not been processed. >> >> >> >>Any help or direction would be welcomed. >> >> >> >>Thanks, >> >>Mark >> >>mark >> >>Mark Woolley |PTRL Laboratory | Avaya | 1300 West 120th Ave | >>Westminster, CO 80234 USA | >> >>Voice (Lab): (303) 538-2166 | email: [log in to unmask] | >> >> >> >> >>______________________________________________________________________ >>This email has been scanned by the Symantec Email Security.cloud service. >>For more information please contact helpdesk at x2960 or [log in to unmask] >>______________________________________________________________________ >> >>--------------------------------------------------- >>Technet Mail List provided as a service by IPC using LISTSERV 16.0 >>To unsubscribe, send a message to [log in to unmask] with following text in >>the BODY (NOT the subject field): SIGNOFF Technet >>To temporarily halt or (re-start) delivery of Technet send e-mail to >>[log in to unmask]: SET Technet NOMAIL or (MAIL) >>To receive ONE mailing per day of all the posts: send e-mail to >>[log in to unmask]: SET Technet Digest >>Search the archives of previous posts at: http://listserv.ipc.org/archives >>For additional information, or contact Keach Sasamori at >>[log in to unmask] or 847-615-7100 ext.2815 >>----------------------------------------------------- > > >______________________________________________________________________ >This email has been scanned by the Symantec Email Security.cloud service. >For more information please contact helpdesk at x2960 or [log in to unmask] >______________________________________________________________________ > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 16.0 >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 >----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------