All,

I would like to know what you think about some contamination causes that were stated on an low volume, high yield electronics manufacturing floor:

1. Adding a small amount of flux to solder paste is contaminating the solder, and not allowing it to flow.

2. Soldering battery terminals with a selective solder machine adds too much solder that when the low power device is turned on, the solder swells causing a short from the positive battery terminal to the ground plane underneath.

3. Using Electro-Wash to clean flux residue from a PCB is contaminating the PCB and solder joints, which causes failures of the circuits.

I do not agree to these, and would like input as to why I might be right or wrong.

Thanks,

Toby Carrier

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