All, I would like to know what you think about some contamination causes that were stated on an low volume, high yield electronics manufacturing floor: 1. Adding a small amount of flux to solder paste is contaminating the solder, and not allowing it to flow. 2. Soldering battery terminals with a selective solder machine adds too much solder that when the low power device is turned on, the solder swells causing a short from the positive battery terminal to the ground plane underneath. 3. Using Electro-Wash to clean flux residue from a PCB is contaminating the PCB and solder joints, which causes failures of the circuits. I do not agree to these, and would like input as to why I might be right or wrong. Thanks, Toby Carrier --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------