Hi Joyce - If you pull a copy of the IPC 7095 standard, it has some of the information you are looking for. We just published our big study on BGA voids at the October SMTAI conference. Pull a copy of the paper "The Last Will and Testament of the BGA Void" for tin/lead joint reliability data. You should also berate Bev as RIM, Indium, and Rockwell Collins are in the final stages of the testing for the leadfree joint reliability version of the ""The Last Will and Testament of the BGA Void" which we are going to publish at the SMTA Toronto Conference in May if it gets accepted. Dave Hillman Rockwell Collins [log in to unmask] Joyce Koo <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 01/26/2012 12:10 PM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Joyce Koo <[log in to unmask]> To <[log in to unmask]> cc Subject [TN] bga-csp voiding reference I am getting old. There is an good reference voids formation at BGA/CSP, regarding the SMT reflow condition vs voids location within the solder joints (near UBM, middle of the solder ball, or close to the bottom of the copper pad, excessive flux, etc.) with all nice schematics, including via in pad and dogbone design. My brain is a Tofu now. Any of the smart guys and gals can lead me to the right paper? Or any of the group members are the author or co-authors of the paper? Really appreciated (didn't even recall author's name or affiliation... totally brain dead). Many thanks in advance. Joyce Koo Materials Researcher - Materials Interconnect Lab Research In Motion Limited Office: (519) 888-7465 79945 Mobile: (226) 220-4760 ---------------------------------------- --------------------------------------------------------------------- This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful. ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------