Well, from what I can tell comparing the data sheets, the ITEQ IT-158 has a LOWER peel strength than the Grace MTC-97, (Iteq is around 7-8? Grace is 11?) And if you are using low-profile copper clad, it will be even lower sorry I can't help more than that, Jack . On Thu, 12 Jan 2012 13:24:40 -0700, Woolley, Mark D. (Mark) <[log in to unmask]> wrote: >Let me add a bit more information on this issue. >1. The material we are having issues with is Iteq IT-158. We are >not seeing any issues with any of the other laminates we are using such >as Grace MTC-97. The Iteq material has higher Tg, Td and pull >strength per specification than the Grace MTC-97 material. >2. The pad layout is identical across the product line. This >includes the distance to the edge of the panel. The pads that are >lifting are on the outside of the laminate. No internal >delaminations have been seen in the cross sections I have made. Internal >delamination si not suspected because the product operates when it is >connected back together. >3. The reflow profile is for Pb-free soldering using SAC305 solder. >The peak temperatures, duration of the temperature and time above >liquidus is the same on all reflow profiles of similar products. > >So I don't think the design is at fault, nor the processing at the >assembly house. The pads are for 8-pin RJ-45 jacks using a standard >pattern. > >I am seeing a ring of cleared copper on the PWB side of the pulled pad. >This is troubling me because I can think of no reason it should be there >unless the etchant was able to get beneath the copper pad. I can post >an image if someone will be so good as to point me to the picture upload >page. (much appreciated). > > >mark >Mark Woolley |PTRL Laboratory | Avaya | 1300 West 120th Ave | >Westminster, CO 80234 USA | >Voice (Lab): (303) 538-2166 | email: [log in to unmask] | > > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------