Hello all - I am working on creating a 24 pin QFN footprint for my CAD library.  Is there a valid reason for making the solder paste smaller than the actual pad outline?  I notice that TI consistently seems to recommend a smaller paste outline than pad outline.  Additionally, they recommend a series of small square paste squares to appear on the thermal pad rather than a single smaller square of paste.  Essentially, IPC-7351 recommendations are different than the TI recommendations.  Any help?  Thank you.

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