ENIPIG. This finish is essentially ENIG with additional layer of Pd. The PD needs to be dissolved as well as the Au before you get to the underlying Ni. In an ideal world you shouldn't notice any difference. Unfortunately this is just the best of all possible worlds. So in practice if it solders a little like slow ENIG that will be reasonable expectation. Be aware though this stuff can easily do a reasonable emulation of wood, [just more expensive]. As to profile adjustments this is somewhat of a "Query string Length" situation. Don't know anything about your work type or existing profile. All we can really say is: If you were starting with a clean sheet, the most likely profile type for success would be a straight ram. Perhaps with a slightly longer TAL and probably with short pause around solidus and then to peak. [As opposed to the now historic/traditional ramp soak ramp]. This to ensure retention of max flux effectiveness though time of joint formation. Regards Mike Fenner Bonding Services & Products T: +44 [0] 1865 522 663 E: [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Gerald Bogert Sent: Saturday, December 10, 2011 12:19 PM To: [log in to unmask] Subject: [TN] Soldering part with CUNIPDAU solder leads December 10, 2011 We have OEM who will be reflow soldering Sn64BCT25244, 24 lead SOIC with CUNIPDAU leads to FR-4 CCA. Any issue with reflow soldering this part using traditional Sn63Pb37 solder alloy? Any unique reflow solder profile required? [log in to unmask] ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------