请教大家:

        通常的SMT流程中,在solder paste printing 之后,都会进行检测锡膏厚度,  并要求控制锡膏的厚度在一定的范围之内. 

在回流之后,是否对焊锡高度也有要求? 如附图. 若是5mil的钢网,回流后焊锡高度(chip 物料), 谢谢!

 

Best Regards

Rocky

 


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