Joseph, I am not sure the PCBA has been contaminated during the cross-section process, but one thing for sure is that we have cross-section for both NG board and good board under the same condition, but only detected the Ai and Si on the NG board. The surface treatment is Immersion Au, the Si and Al can be only detected on non-wetting hole as below. Hi Ken Chow, What evidence we may look into as a measurement in determining of rework at PCB housing. Thanks Rainbow From: TGAsia [mailto:[log in to unmask]] On Behalf Of Joseph Ho Sent: Tuesday, November 22, 2011 1:14 PM To: [log in to unmask] Subject: Re: [TGAsia] Non-wetting on PTH top surface Did you place the board in an area for cross-sectioning as the emery paper used in polishing the cross-section may have the Al and Si. The solder surface is so soft that the Al and Si particles may have been embedded on the surface causing such result in EDX. Best Regards, Joseph Ho Senior Quality System Manager, QS and LEAN Multek Display Limited Tel : (86) 755 2862 0888 Ext.269 Mobile: (86) 138 25275770 Endless innovation creates changes for tomorrow ________________________________ From: TGAsia [mailto:[log in to unmask]] On Behalf Of Ken Chow Sent: Tuesday, November 22, 2011 11:30 AM To: [log in to unmask] Subject: Re: [TGAsia] Non-wetting on PTH top surface May be the board has been reworked by powder polishing such as jet scrubbing or manual sanding (Al2O3 and Si2O4) Thanks and best regards, Ken Chow OEM & Business Development Director, Enthone, Cookson Electronics Mobile: +852-9408-4736 ________________________________ From: Tan Geok Ang [[log in to unmask]] Sent: 11/22/2011 10:04 ZE8 To: <[log in to unmask]> Subject: Re: [TGAsia] Non-wetting on PTH top surface Did you EDX the different between the non-wetting points vs. solder joints? Are you using ImAg PCB surface? ________________________________ From:TGAsia [mailto:[log in to unmask]] On Behalf Of Rainbow Zhang Sent: Monday, 21 November 2011 10:06 AM To: [log in to unmask] Subject: Re: [TGAsia] Non-wetting on PTH top surface Hi All, I want to share a case with you all here and collect your comments as I get a little stuck in determining what is real root of the issue. Referring to the photo attached the solder pad was not fully covered by solder after manually solder, not meeting the IPC-610 requirement of at minimum of 75% solder be covered around the pad. observed under digit camera there some darkish residue remained on there, and main elements spot by EDX as illustrated, to what surprise is where did Al and SI come from since the used solder material do not contain these two elements. Legal Disclaimer: The information contained in this message may be privileged and confidential. 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