Hi All,

 

I want to share a case with you all here and collect your comments as I get a little stuck in determining what is real root of the issue.

 

Referring to the photo attached the solder pad was not fully covered by solder after manually solder, not meeting the IPC-610 requirement of at minimum of 75% solder be covered around the pad. observed under digit camera there some darkish residue remained on there, and main elements spot by EDX as illustrated, to what surprise is where did Al and SI come from since the used solder material do not contain these two elements.

 

 

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