我的理解是:
可能部分元器件在貼在PCB PAD上,元器件与PAD間的焊錫厚度!
From:
Rocky Wang [mailto:[log in to unmask]]
Sent: Wednesday, November 09, 2011
10:58 AM
To: airmy(b 鄧冬強);
Asia Committe Task Group Forum
Subject: RE: [TGAsia] 焊锡高度定义
Airmy,谢谢.
请问大家,下图中的G是如何具体定义的?
Best Regards
Rocky
From:
airmy(b 鄧冬強)
[mailto:[log in to unmask]]
Sent: Wednesday, November 09, 2011
10:44 AM
To: Asia Committe Task Group
Forum; Rocky Wang
Subject: RE: [TGAsia] 焊锡高度定义
有, 請參閱“IPC –A- 610E”第8節SMT工法部分
[log in to unmask]">
From:
TGAsia [mailto:[log in to unmask]] On Behalf Of Rocky
Wang
Sent: Wednesday, November 09, 2011
10:12 AM
To: [log in to unmask]
Subject: [TGAsia] 焊锡高度定义
请教大家:
通常的SMT流程中,在solder
paste printing 之后,都会进行检测锡膏厚度,
并要求控制锡膏的厚度在一定的范围之内.
在回流之后,是否对焊锡高度也有要求? 如附图. 若是5mil的钢网,回流后焊锡高度(chip
物料), 谢谢!
Best Regards
Rocky
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________