请教大家: 通常的SMT流程中,在solder paste printing 之后,都会进行检测锡膏厚度, 并要求控制锡膏的厚度在一定的范围之内. 在回流之后,是否对焊锡高度也有要求? 如附图. 若是5mil的钢网,回流后焊锡高度(chip 物料), 谢谢! Best Regards Rocky ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________