IPC 610 E
过炉后只有爬锡高度要求
 
Thanks and Best Regards

Sonic Lu 陆尚
Process Engineer
Autoliv Electronics China (ACE) Co.,Ltd
Tel:  +86-21-67109300-3162


Rocky Wang <[log in to unmask]>
Sent by: TGAsia <[log in to unmask]>

2011-11-09 10:11

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[TGAsia] 焊锡高度定义





请教大家:
        通常的SMT流程中,在solder paste printing 之后,都会进行检测锡膏厚度,  并要求控制锡膏的厚度在一定的范围之内.  
在回流之后,是否对焊锡高度也有要求? 如附图. 若是5mil的钢网,回流后焊锡高度(chip 物料), 谢谢!
 
Best Regards
Rocky
 


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