Here is a lot to learn about e-paper. Not for you actual quiz but to be read for fun. Inge http://www.epapercentral.com/epaper-technologies-guide On 14 November 2011 13:56, Inge Hernefjord <[log in to unmask]> wrote: > > Rocky, > there are lots of 'it depends', as would say certain can opener. > - What kind of product, commercial, MIL, Space, toys etc? These dictate > the general requirements > - decide low moisture permeability level > - decide mobile ions barrier > - decide level of repair ability > - decide level of encapsulant purity > - decide the dielectric constant to match the propagation delay > requirements > - decide the vulnerability against alfa particles (some semis are) > - decide the thermal conductivity > - surface tension (vs encapsulant) > -decide warpage > -others may fill in...lots > > To use Pertinax or CEM is maybe not an easy task for unexperienced > designers, but could be a good idea if you got money and time and lots of > go in you. I don't belong to the rigid who say No to every unusual > proposal. You have probably seen the 'computers' built on paper and which > can be rolled and put in a tube. So, why not make a try. Personally, i know > little about paper substrates. > > So, it's not easy to give a precise advice not knowing the expected final > product. > I was engaged in COB twenty years ago, very amusing job. There is a lot of > litterature about COB, one very good book is this one: > Chip On Board edited by John H. Lau ISBN 0-442-014441-4 Van Nostrand > Reinhold NY > > Good Luck > > Inge > > > > On 14 November 2011 14:25, Joyce Koo <[log in to unmask]> wrote: > >> BT >> >> -----Original Message----- >> From: TechNet [mailto:[log in to unmask]] On Behalf Of Rocky Wang >> Sent: Monday, November 14, 2011 3:22 AM >> To: [log in to unmask] >> Subject: [TN] PCB substrate material choose for COB product >> >> Hello Technetters; >> If there anybody has the knowledge to choose the PCB substrate >> material (Paper board, CEM, FR-4) for COB product? For sure FR4 will be >> the best. However, why in some case, Paper material work, and in some case, >> go to CEM material. If there have some choose guideline, such as from the >> die bonding pad size, pad pitch, number of bonding wire, and the size of >> the bonding wire or other conditions? >> >> Best Regards >> Rocky >> >> >> ______________________________________________________________________ >> This email has been scanned by the MessageLabs Email Security System. >> For more information please contact helpdesk at x2960 or [log in to unmask] >> ______________________________________________________________________ >> >> --------------------------------------------------- >> Technet Mail List provided as a service by IPC using LISTSERV 16.0 >> To unsubscribe, send a message to [log in to unmask] with following text in >> the BODY (NOT the subject field): SIGNOFF Technet >> To temporarily halt or (re-start) delivery of Technet send e-mail to >> [log in to unmask]: SET Technet NOMAIL or (MAIL) >> To receive ONE mailing per day of all the posts: send e-mail to >> [log in to unmask]: SET Technet Digest >> Search the archives of previous posts at: >> http://listserv.ipc.org/archives >> For additional information, or contact Keach Sasamori at [log in to unmask] 847-615-7100 >> ext.2815 >> ----------------------------------------------------- >> >> --------------------------------------------------------------------- >> This transmission (including any attachments) may contain confidential >> information, privileged material (including material protected by the >> solicitor-client or other applicable privileges), or constitute non-public >> information. 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