Thanks, Wayne - I sincerely appreciate the input. I've been tracking this issue for another engineer here at ITT so I will forward your input to him. Thanks again. Bill Noel ITT Geospatial Systems Division 400 Initiative Drive Rochester, New York 14606-0488 P: (585) 269-5911 F: (585) 672-8042 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW Sent: Wednesday, September 07, 2011 4:40 PM To: [log in to unmask] Subject: Re: [TN] Gold / Nickel Plating Hi Bill- Feel free to give me a call to talk about this since we have a bunch of experience designing with flex and wirebonds. I agree with Steve, but would add that that amount of plating will embrittle the flex, so make sure it doesn't bend where there's plating. Also, if too much soft gold, the ultrasonics don't like it--the vast amount of mushy material dampens the "scrub". Wayne Thayer -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick Sent: Friday, September 02, 2011 2:41 PM To: [log in to unmask] Subject: Re: [TN] Gold / Nickel Plating Bill, You did not indicate whether you were using Au or Al wire. If using a thermosonic gold process, all should be well. The wire will adore the extra gold, so long as it is as specified, and not 'hard' However, if you are Al bonding, you have way too much gold thickness allowed, even in the original specification [which makes me think you are Au bonding - I hope!] Julie's comment is correct as it applies to Au bonding. However, with Al we just blast through the surface oxides the majority of the time. Where can the rest of us go to get some free/extra gold?? Regards Steve Creswick Sr Associate - Balanced Enterprise Solutions http://www.linkedin.com/in/stevencreswick 616 834 1883 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Noel, William J - GS Sent: Tuesday, August 23, 2011 12:29 PM To: [log in to unmask] Subject: [TN] Gold / Nickel Plating Hello all - We have some flexes that were designed for a wire bonding application and the finish in the wirebonding area was specified on the fabrication drawing as follows: BOND PAD AREAS, AS DEFINED BY THE EXPOSED COPPER AREA, SHALL BE PLATED AS FOLLOWS: 30 - 100 MICROINCHES OF SOFT GOLD PER MIL-G-45204, TYPE III, GRADE A OVER 200 -100/+250 MICROINCHES OF SOFT NICKEL PER MIL-P-27418. (SULFAMATE BATH) GOLD PLATING UNDER THE OUTER LAYER LAMINATE IS ALLOWED TO A MAXIMUM OF .050 Upon inspection, we are finding samples that exceed the maximums in the area of 400-500 microinches of gold and 500-600 microinches of nickel. We are wondering if these would still be acceptable for our wirebonding application. Any help? Thanks in advance. Bill Noel ITT Geospatial Systems Division 400 Initiative Drive Rochester, New York 14606-0488 P: (585) 269-5911 F: (585) 672-8042 ________________________________ This e-mail and any files transmitted with it may be proprietary and are intended solely for the use of the individual or entity to whom they are addressed. If you have received this e-mail in error please notify the sender. Please note that any views or opinions presented in this e-mail are solely those of the author and do not necessarily represent those of ITT Corporation. The recipient should check this e-mail and any attachments for the presence of viruses. ITT accepts no liability for any damage caused by any virus transmitted by this e-mail. ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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