Hi All,
Anyone know of a  gold system process that allows me to build gold to a thickness of .4 to .9 microns on top of 2.5 microns of nickel. No electroplating connection to 98% of the pads (not even through the back side) . Customer insists this can be electroplated - is this the DIG process. I do not want to use gold as the etch resist. Thanks. Steve Kelly

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