Hi All, Anyone know of a gold system process that allows me to build gold to a thickness of .4 to .9 microns on top of 2.5 microns of nickel. No electroplating connection to 98% of the pads (not even through the back side) . Customer insists this can be electroplated - is this the DIG process. I do not want to use gold as the etch resist. Thanks. Steve Kelly --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------