I have a design with a T03 can in which the lead diameter is between
0.016" and 0.021".
My memory leads me to say the hole should be 0.017" larger than nominal
lead diameter but I don't remember where it is documented in the IPC
standards.
Where is the design guideline located for the proper hole diameter for
the board.  And does it matter if it is hand soldered or wave soldered.

Thanks in advance.

 

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