Dear Jima,

從不良外觀看,不是包覆形狀處也有吃錫不良情形,不良很可能源於pin的表面處理,或者鍍層太薄導致底材氧化,或者鍍層夠厚,電鍍品質不良造成的.

 

From: TGAsia [mailto:[log in to unmask]] On Behalf Of David Lau
Sent: Wednesday, July 20, 2011 11:06 AM
To: [log in to unmask]
Subject: Re: [TGAsia] D-Sub ConnectorPin 吃錫不良

 

Jima,

本人认为根本原因来自pin脚形状和镀层，建议剪短脚（小于0.8mm)过炉焊接观其效果.

 

Regards!

David Lau

 

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Jima Hsieh [謝國偉]
Sent: 2011年7月20日 10:37
To: [log in to unmask]
Subject: [TGAsia] D-Sub ConnectorPin 吃錫不良

 

各位同業先進

下面這種包覆式的Pin腳的D-Sub Connector在過波焊爐(Wave Soldering)時幾乎都會有吃錫不良現象

我司製程已調整過Flux、Conveyer速度調整過無法改善，機板其他位置吃錫狀況都沒問題，工程初步判定是零件原材問題

但因為此零件每批投產在縫隙處方幾乎吃錫狀況都不好，這樣吃錫異常是否有可能是的包覆式Pin腳設計造成的?

不知各位是否有遇到相同的狀況?(這樣的吃錫無法符合焊接起始面引腳與孔璧吃錫須達270°的要求)

請大家不吝賜教，謝謝

 

吃錫不良1

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吃錫不良2

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原材外觀

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Best Regards,

Jima Hsieh

 


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