根据7530的标准,从理论上flux也不可能全部挥发,当助焊剂中的一些成分从共价键转变成离子态之后就再也不会挥发了，有残留很正常的。如果需要证明可以测试ions
concentration，选择性波峰焊也好，回流焊也罢，只要是免洗工艺，flux的残留是避免不了的，清洗的清理的方式很简单
方案1：过炉后使用清洗工艺进行清洗
方案2：select wave 少喷点flux
方案3：使用残留少的flux
Thanks and Best Regards
Sonic Lu 陆尚
Process Engineer
Autoliv Electronics China (ACE) Co.,Ltd
Tel: +86-21-67109300-3162
按理论来讲，助焊剂在预热区就应该挥发了，在选择性波峰焊之后会出现这样的助焊剂残留么？
如果是，如何清理？
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, July 25, 2011 12:49 PM
To: Asia Committe Task Group Forum; Eileen Xiang
Cc: [log in to unmask]
Subject: Re: [TGAsia] 焊点上的黄色物质接收否？
助焊剂残留
Thanks and Best Regards
Sonic Lu 陆尚
Process Engineer
Autoliv Electronics China (ACE) Co.,Ltd
Tel: +86-21-67109300-3162
Hi all
哪位大侠能分享一下经验。图片中引脚周围焊锡表面的物质是什么？（颜色为黄黑色，清洗不掉）
现象出现在波峰焊之后，为无铅3级产品。
请问这种现象正常否，适用IPC
610E里的哪一条？是否可以接受？
这种现象的原因有哪些？怎样避免？
Thanks!
BR/Eileen
From: TGAsia [mailto:[log in to unmask]] On Behalf Of ??
Sent: Thursday, July 21, 2011 2:39 PM
To: [log in to unmask]
Subject: Re: [TGAsia] 板边白色粉尘状物质
原因分析：
1、可能是你PCB材质不易分板作业，所以在分板作业时，就会出现基板硬撕裂现象，也就是图示那种板边出现的物质。
2、可能是你PCB
V_CUT设计不到位，所以在分板作业时，基板的分割切线不是正对V-CUT，因此也会出现图示那咱板边出现的物质。
影响说明：
1、在不影响装配、外观及其它性能方面外，个人认为是没有关系的。
2、对于CCD、镜头、摄像头基板页言，若基板分板后有这种物质出现，就要注意了，可能表象不会有什么特别影响，但若经过振动、摇晃等场合时，可能会出现边板物质的脱落，从而引起相应取影的不良、异物、杂点现象，所以此时个人建议制成警示，最好改变拼板方式！
以上
个人掘见！仅供参考！
----- Original Message -----
From: Kevin
Qu
To: [log in to unmask]
Sent: Thursday, July 21, 2011 2:23 PM
Subject: [TGAsia] 板边白色粉尘状物质
All
参考附件图片，分板后有一部分板的板边发现有白色粉尘状物质，请问是什么原因导致？
有什么样的影响？
BRs！
Kevin Qu
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