Dear All
感謝各位的回覆,Thanks, It really helps!
這顆零件有做過沾錫試驗，吃錫狀況其實還算OK(除了溝槽處)，外觀看起來也沒有氧化，我們也直覺懷疑是鍍層問題
不過這顆零件自從有交料以來幾乎每批都出現吃錫問題，跟廠商討論肇因卻都不了了之沒有結論
(我們無法證明鍍層問題是主因，廠商也無法質疑我們製程有問題，最後總是廠商提供備品後了事，你們懂的…)
所以讓我不禁懷或許真的不是鍍層的問題，而是PCB內層線路散熱設計的問題，因為不良位置確實有GND大銅箔面存在
但問題是同一片板子其他連接器也一樣有GND經過，但相同波焊製程之下卻沒有吃錫問題
所以最後我才懷疑這種中空的Pin腳在波峰焊接過成中會形成某種不利於吃錫的現象導致焊錫不佳(例如pin腳中空氣無法排出?)
若這種狀況若存在的話，其機制會是如何形成的?
再次謝謝各位撥控一起討論、交流
Best Regards,
Jima Hsieh
________________________________
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Sonic Lu
Sent: Wednesday, July 20, 2011 1:08 PM
To: [log in to unmask]
Subject: Re: [TGAsia] 答复: D-Sub ConnectorPin 吃錫不良
这颗零件可以按照J STD 002的标准进行可焊性测试，建议使用method F or Method E方法进行测试，确认沾锡能力测试的结果
同时可以按照JEDEC22-B102E的方式进行dip&look的方式进行测试，确认零件沾锡是否异常
从您的照片看，零件似乎应该是表面的镀层出现异常，造成焊锡困难
Thanks and Best Regards
Sonic Lu 陆尚
Process Engineer
Autoliv Electronics China (ACE) Co.,Ltd
Tel: +86-21-67109300-3162
Wellington Li <[log in to unmask]>
Sent by: TGAsia <[log in to unmask]>
2011-07-20 13:06
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Asia Committe Task Group Forum <[log in to unmask]>; Please respond to
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[TGAsia] 答复: D-Sub ConnectorPin 吃錫不良
Dear Jima
我的理解：
请先做个手工焊接实验，只对Pin脚或组装PCB进行焊接实验（温度、时间可做对比性调整）：
如果焊接效果不好（上锡），基本就如之前相关同仁所言的端子Pin脚来料不良（表面处理）；
如果手工焊接效果可以接受，则应考虑整个PCBA的散热设计存在失误。对策有两个：手工焊接或者后续进行PCB设计更改/ PIN脚长做适当调整。
以提高其“可制造性”。
Best regards,
Wellington Li 李永江
Assessor
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发件人: TGAsia [mailto:[log in to unmask]] 代表 Jima Hsieh [謝國偉]
发送时间: 2011年7月20日 10:37
收件人: [log in to unmask]
主题: [TGAsia] D-Sub ConnectorPin 吃錫不良
各位同業先進
下面這種包覆式的Pin腳的D-Sub Connector在過波焊爐(Wave Soldering)時幾乎都會有吃錫不良現象
我司製程已調整過Flux、Conveyer速度調整過無法改善，機板其他位置吃錫狀況都沒問題，工程初步判定是零件原材問題
但因為此零件每批投產在縫隙處方幾乎吃錫狀況都不好，這樣吃錫異常是否有可能是的包覆式Pin腳設計造成的?
不知各位是否有遇到相同的狀況?(這樣的吃錫無法符合焊接起始面引腳與孔璧吃錫須達270°的要求)
請大家不吝賜教，謝謝
吃錫不良1
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吃錫不良2
[cid:[log in to unmask]]
原材外觀
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Best Regards,
Jima Hsieh
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