Good deal of lamination dents - also appears to be delam with larger holes and slots - both may routed depending on hole size and this could indicate some issue in intralam bond strengths. Need a micro section to see where this condition is indicated. Jeffrey Bush BAE Systems Incorporated Electronic Systems Division IS&R - Space Products and Systems P.O. Box 868, MER24-01G43 Nashua, NH 03061-0868 Office +1 603.885.8137 Mobile +1 603.318.8056 Fax +1 603.885.5258 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Pete Sent: Friday, July 29, 2011 10:15 AM To: [log in to unmask] Subject: [TN] Fab defects - process or mechanical? Our assembly vendor is telling us they found a number of defects on a small shipment of fabs. Some of these are a bit odd looking, some are obvious. BUT, two of the pictures show obvious mechanical damage. http://ipc-technet.groupsite.com/gallery/20826 A little background: boards were quick turn, from a vendor we have used for 20 years with extremely good results. Shipped to Hong Kong, where the vendor couldn't locate them for over 2 weeks. Now they found them, said the vacuum bags were compromised, moisture indicators were pink. We just need about 35 of these built for internal testing, we don't need long term field reliability. Any ideas what this might be, and would you use them for engineering purposes? BTW, this is clear soldermask, outer layers are copper planes. Thanks, Pete --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------