Assuming you paste your vias... How many people do that? . On Mon, Jul 11, 2011 at 9:41 AM, Wenger, George M. < [log in to unmask]> wrote: > Jack, > > If you use fluxes and solder pastes that are compliant to the Telcordia > GR-78_CORE Generic Requirements for the Physical Design and Manufacture of > Telecommunications Products and Equipment you should see any creeping crud > growth on ImAg or OSP assemblies. > > Regards, > George > George M. Wenger > Senior Principal Reliability / FMA Engineer > Andrew Corporation - Wireless Network Solutions > 40 Technology Drive, Warren, NJ 07059 > (908) 546-4531 Office (732) 309-8964 Mobile > E-mail: [log in to unmask] > > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson > Sent: Monday, July 11, 2011 10:18 AM > To: [log in to unmask] > Subject: Re: [TN] Leaded or non > > I would have said that too, until I started seeing pictures of the creeping > crud growth on ImAg vias in older assemblies. > (which we use for test points, so they are exposed) How do you get around > that? Do you paste screen your vias? or conformal coat by default after ICT? > > Jack > > On Thu, 7 Jul 2011 14:26:16 -0500, David D. Hillman < > [log in to unmask]> wrote: > > >Hi Steve - my vote would be the ImAg and lead-free assembly choice. All > >three of your options should work with each having both pluses and > >minuses. My preference is to solder to copper rather than nickel if given > >a choice. > > > >Dave Hillman > >Rockwell Collins > >[log in to unmask] > > > > > > > >Steven Kelly <[log in to unmask]> > >Sent by: TechNet <[log in to unmask]> > >07/07/2011 12:56 PM > >Please respond to > >TechNet E-Mail Forum <[log in to unmask]>; Please respond to > >Steven Kelly <[log in to unmask]> > > > > > >To > ><[log in to unmask]> > >cc > > > >Subject > >[TN] Leaded or non > > > > > > > > > > > > > >Hi All, > >I have an 18 layer rigid flex (buried and blind) that we are preparing to > >put the surface finish on and then assemble. > >Lots of BGA's etc. > >The BGA's are lead free. > >Options: > > > >1) ENIG and lead free assembly > > > >2) Immersion silver and lead free assembly > > > >3) HASL and leaded assembly > >Hi end military product. > > > >Thoughts or comments would be appreciated. > >Thanks. Steve Kelly > > > >--------------------------------------------------- > >Technet Mail List provided as a service by IPC using LISTSERV 16.0 > >To unsubscribe, send a message to [log in to unmask] with following text in > >the BODY (NOT the subject field): SIGNOFF Technet > >To temporarily halt or (re-start) delivery of Technet send e-mail to > >[log in to unmask]: SET Technet NOMAIL or (MAIL) > >To receive ONE mailing per day of all the posts: send e-mail to > >[log in to unmask]: SET Technet Digest > >Search the archives of previous posts at: > http://listserv.ipc.org/archives > >For additional information, or contact Keach Sasamori at [log in to unmask] > >847-615-7100 ext.2815 > >----------------------------------------------------- > > > > > > > >______________________________________________________________________ > >This email has been scanned by the MessageLabs Email Security System. > >For more information please contact helpdesk at x2960 or [log in to unmask] > >______________________________________________________________________ > > > >--------------------------------------------------- > >Technet Mail List provided as a service by IPC using LISTSERV 16.0 > >To unsubscribe, send a message to [log in to unmask] with following text in > >the BODY (NOT the subject field): SIGNOFF Technet > >To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > >To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > >Search the archives of previous posts at: > http://listserv.ipc.org/archives > >For additional information, or contact Keach Sasamori at [log in to unmask] 847-615-7100 > ext.2815 > >----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 16.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > For additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------